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Title	Author(s)	Issue Date	Views
Aerobic and anaerobic degradation pathways for N-heterocyclic aromatic compound indole Journal:Bulletin of Mineralogy Petrology and Geochemistry	Wang, YY Yip, CW Fan, YZ Gu, JD	2003	76
Analysis of parental strain DNA fragments existing in GEMs-Fhhh Journal:Journal of Environmental Sciences	Hao, CB Yan, J Qu, MM Wang, D Cheng, SP Gu, JD Qiu, WF Wang, YY	2003	201
Au/GaAs interface annealing study by positron-lifetime spectroscopy Journal:Physical Review B (Condensed Matter)	Shan, YY Panda, BK Fung, S Beling, CD Wang, YY	1995	167
Behavior of copper removal by CMP and its correlation to deposit structure and impurity content Journal:Journal of the Electrochemical Society	Feng, HP Lin, JY Cheng, MY Wang, YY Wan, CC	2008	196
Biomimetic synthesis of struvite with biogenic morphology and implication for pathological biomineralization Journal:Scientific Reports	Li, H Yao, QZ Wang, YY Li, Y Zhou, GT	2015	78
Breaking Earth’s shell into a global plate network Journal:Nature Communications	Tang, CA Webb, AAG Moore, WB Wang, YY Ma, TH Chen, TT	2020	12
Changes in BMI before and during economic development and subsequent risk of cardiovascular disease and total mortality: A 35-year follow-up study in China Journal:Diabetes Care	He, Y Lam, TH Jiang, B Li, LS Sun, DL Wu, L Liu, M Yang, SS Wang, YY Tobias, DK Sun, Q Hu, FB	2014	215
Defending and improving the 'slotting fee': how it can benefit all the stakeholders dealing with a newsvendor product with price and effort-dependent demand Journal:Journal of the Operational Research Society	Wang, YY Lau, HS Wang, JC	2012	97
Displacement reactions between metal ions and nitride barrier layer/silicon substrate Journal:Journal of the Electrochemical Society	Wu, Y Chen, WC Feng, HP Wan, CC Wang, YY	2002	1440
Effect of impurity and illumination on copper oxidation after chemical mechanical polishing Journal:Journal of the Electrochemical Society	Feng, HP Lin, JY Wang, YY Wan, CC	2008	1448
Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation Journal:Journal of Electronic Materials	Feng, HP Wu, Y Wang, YY Wan, CC	2003	193
Impurities induced localized corrosion between copper and tantalum nitride during chemical mechanical planarization Journal:Electrochemical and Solid-State Letters	Lin, JY Wang, YY Wan, CC Feng, HP Cheng, MY	2007	197
Inhibition of TGF-β Signaling in SHED Enhances Endothelial Differentiation Journal:Journal of Dental Research	Xu, J Gong, T Wang, YY Zou, T Heng, BCA Yang, Y Zhang, C	2018	100
Interstitial Point Defect Scattering Contributing to High Thermoelectric Performance in SnTe Journal:Advanced Electronic Materials	Pei, YZ Zheng, LL Li, W Lin, SQ Chen, ZW Wang, YY Xu, XF YU, H Chen, Y Ge, BH	2016	159
Investigation of the behaviors of various electroplated copper films during CMP Proceeding/Conference:2006 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2006 Technical Proceedings	Feng, HP Cheng, MY Wang, YY Wan, CC	2006	126
Mechanism for Cu void defect on various electroplated film conditions Journal:Thin Solid Films	Feng, HP Cheng, MY Wang, YL Chang, SC Wang, YY Wan, CC	2006	189
Momentum-dependent charge transfer excitations in Sr2CuO2Cl2 angle-resolved electron energy loss spectroscopy Journal:Physical Review Letters	Wang, YY Zhang, FC Dravid, VP Ng, KK Klein, MV Schnatterly, SE Miller, LL	1996	47
Momentum-transfer resolved electron energy loss spectroscopy of solids: Problems, solutions and applications Proceeding/Conference:Ultramicroscopy	Wang, YY Cheng, SC Dravid, VP Zhang, FC	1995	55
Offline signature verification by the analysis of cursive strokes Journal:International Journal of Pattern Recognition and Artificial Intelligence	Fang, B Wang, YY Leung, CH Tse, KW Tang, YY Kwok, PCK Wong, YK	2001	187
Positron mobility and interface defect studies in semi-insulating GaAs using the lifetime technique Proceeding/Conference:Materials Science Forum	Shan, YY Ling, CC Au, HL Fung, S Beling, CD Wang, YY	1995	121

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