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Browsing by Author CHEN, CM
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Showing results 1 to 20 of 22
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Title
Author(s)
Issue Date
Views
Anisotropic four-dimensional Neveu-Schwarz–Neveu-Schwarz string cosmology
Journal:
Physical Review D (Particles and Fields)
Chen, CM
Harko, T
Mak, MK
2001
127
Bianchi type I cosmologies in arbitrary dimensional dilaton gravities
Journal:
Physical Review D (Particles and Fields)
Chen, CM
Harko, TC
Mak, MK
2000
Bianchi type I cosmology in N=2, D=5 supergravity
Journal:
Physical Review D (Particles and Fields)
Chen, CM
Harko, TC
Mak, MK
2000
142
COVID‐19 and nursing research across five countries/regions: Commonalities and recommendations
Journal:
Research in Nursing & Health
Im, EO
Sakashita, R
Oh, EG
Tsai, HM
Chen, CM
Lin, CC
McCauley, L
2021
Effect of polyimide baking on bump resistance in flip-chip solder joints
Journal:
Microelectronics Reliability
Cheng, HK
Feng, SPT
Lai, YJ
Liu, KC
Wang, YL
Liu, TF
Chen, CM
2014
126
Electrochemical fabrication of transparent nickel hydroxide nanostructures with tunable superhydrophobicity/superhyrophilicity for 2D microchannels application
Journal:
Journal of Materials Chemistry A
CHANG, YH
HUANG, Y-T
Lo, MK
Lin, CF
Chen, CM
Feng, SPT
2014
53
Electrodeposition of (111)-Oriented and Nanotwin-Doped Nanocrystalline Cu with Ultrahigh Strength for 3D IC Application
Journal:
Nanotechnology
ZHENG, Z
Huang, YT
WANG, Z
ZHANG, M
Wang, WT
Chung, CC
Cherng, SJ
Tsai, YH
Li, PC
Lu, Z
Chen, CM
Feng, SP
2021
19
Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3
Journal:
Journal of Electronic Materials
TSENG, YC
LEE, H
HAU, NY
Feng, SPT
CHEN, CM
2018
42
Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints
Journal:
Journal of the Electrochemical Society
Chiang, PC
Shen, YA
Feng, SP
Chen, CM
2021
7
Exact anisotropic brane cosmologies
Journal:
Physical Review D (Particles and Fields)
Chen, CM
Harko, TC
Mak, MK
2001
165
Fabrication and characterization of interconnected grid-type dye-sensitized solar modules
Journal:
International Journal of Electrochemical Science
Wei, TC
Feng, SP
Chang, YH
Cherng, SJ
Lin, YJ
Chen, CM
Chen, HH
2012
81
Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing
Journal:
Journal of Electronic Materials
LAI, KC
WU, PY
CHEN, CM
WEI, TC
WU, CH
Feng, SPT
2016
49
Microfluidic Applications in Drug Development: Fabrication of Drug Carriers and Drug Toxicity Screening
Journal:
Micromachines
Zhao, P
Wang, JC
Chen, CM
Wang, JM
Liu, GX
Nandakumar, K
Li, Y
Wang, L
2022
Nickel substrate covered with a Sn-based protection bi-layer as a photoanode substrate for dye-sensitized solar cells
Journal:
Electrochimica Acta
Huang, Y
Feng, SPT
Chen, CM
2013
44
Nonspecular Reflection of Droplets
Journal:
Small
Zhu, P
Chen, CM
Nandakumar, K
Wang, L
2021
Rotational perturbations in Neveu-Schwarz–Neveu-Schwarz string cosmology
Journal:
Physical Review D (Particles and Fields)
Chen, CM
Harko, TC
Mak, MK
2001
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
Journal:
Microelectronics Reliability
ZHENG, Z
Chiang, PC
Huang, YT
Wang, WT
Li, PC
Tsai, YH
Chen, CM
Feng, SP
2019
60
Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit
Journal:
JOM
Tsai, ST
Chiang, PC
Liu, C
Feng, SP
Chen, CM
2019
Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells
Journal:
Journal of The Electrochemical Society
Huang, Y
Zhan, YY
Cherng, SJ
Chen, CM
Feng, SPT
Wei, TC
2013
67
Surface Silanization of Polyimide for Autocatalytic Metallization
Journal:
JOM
Liu, JN
Sil, MC
CHENG, R
Feng, SP
Chen, CM
2020
