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Article: Effect of polyimide baking on bump resistance in flip-chip solder joints

TitleEffect of polyimide baking on bump resistance in flip-chip solder joints
Authors
Cheng, HKFeng, SPTLai, YJLiu, KCWang, YLLiu, TFChen, CM
Issue Date2014
Citation
Microelectronics Reliability, 2014, v. 54, p. 629 How to Cite?
DOI: http://dx.doi.org/10.1016/j.microrel.2013.11.006
Persistent Identifierhttp://hdl.handle.net/10722/200676
ISI Accession Number ID
WOS:000334007000014

 

DC FieldValueLanguage
dc.contributor.authorCheng, HKen_US
dc.contributor.authorFeng, SPTen_US
dc.contributor.authorLai, YJen_US
dc.contributor.authorLiu, KCen_US
dc.contributor.authorWang, YLen_US
dc.contributor.authorLiu, TFen_US
dc.contributor.authorChen, CMen_US
dc.date.accessioned2014-08-21T06:54:19Z-
dc.date.available2014-08-21T06:54:19Z-
dc.date.issued2014en_US
dc.identifier.citationMicroelectronics Reliability, 2014, v. 54, p. 629en_US
dc.identifier.urihttp://hdl.handle.net/10722/200676-
dc.languageengen_US
dc.relation.ispartofMicroelectronics Reliabilityen_US
dc.titleEffect of polyimide baking on bump resistance in flip-chip solder jointsen_US
dc.typeArticleen_US
dc.identifier.emailFeng, SPT: hpfeng@hku.hken_US
dc.identifier.authorityFeng, SPT=rp01533en_US
dc.identifier.doi10.1016/j.microrel.2013.11.006-
dc.identifier.scopuseid_2-s2.0-84896733779-
dc.identifier.hkuros234426en_US
dc.identifier.volume54en_US
dc.identifier.spage629en_US
dc.identifier.epage629en_US
dc.identifier.isiWOS:000334007000014-

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