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Article: Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing

TitleInterfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing
Authors
KeywordsAnnealing
diffusion
electroless
microstructures
nickel
Issue Date2016
Citation
Journal of Electronic Materials, 2016, v. 45, p. 4813-4822 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/227334
ISSN
2023 Impact Factor: 2.2
2023 SCImago Journal Rankings: 0.439
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorLAI, KC-
dc.contributor.authorWU, PY-
dc.contributor.authorCHEN, CM-
dc.contributor.authorWEI, TC-
dc.contributor.authorWU, CH-
dc.contributor.authorFeng, SPT-
dc.date.accessioned2016-07-18T09:09:51Z-
dc.date.available2016-07-18T09:09:51Z-
dc.date.issued2016-
dc.identifier.citationJournal of Electronic Materials, 2016, v. 45, p. 4813-4822-
dc.identifier.issn0361-5235-
dc.identifier.urihttp://hdl.handle.net/10722/227334-
dc.languageeng-
dc.relation.ispartofJournal of Electronic Materials-
dc.subjectAnnealing-
dc.subjectdiffusion-
dc.subjectelectroless-
dc.subjectmicrostructures-
dc.subjectnickel-
dc.titleInterfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing-
dc.typeArticle-
dc.identifier.emailFeng, SPT: hpfeng@hku.hk-
dc.identifier.authorityFeng, SPT=rp01533-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s11664-016-4708-x-
dc.identifier.scopuseid_2-s2.0-84974801261-
dc.identifier.hkuros258966-
dc.identifier.volume45-
dc.identifier.spage4813-
dc.identifier.epage4822-
dc.identifier.eissn1543-186X-
dc.identifier.isiWOS:000382585400014-
dc.identifier.issnl0361-5235-

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