File Download
Patent History
- ApplicationUS 11/827665 2004-04-19
- PublicationUS 20040265614 2004-12-30
- GrantedUS 7306683 2007-12-11
Patent Family
- CN 1806060 (A) 2006-07-19
- CN 100432257 (C) 2008-11-12
- CN 101333611 (A) 2008-12-31
- EP 1629133 (A1) 2006-03-01
- JP 2006523770 (A) 2006-10-19
- US 2004265614 (A1) 2004-12-30
- US 7306683 (B2) 2007-12-11
- US 2004230193 (A1) 2004-11-18
- US 7695471 (B2) 2010-04-13
- US 2008053575 (A1) 2008-03-06
- US 7789975 (B2) 2010-09-07
- WO 2004092431 (A1) 2004-10-28
Supplementary
-
Citations:
- Appears in Collections:
granted patent: Shape Memory Material And Method Of Making The Same
Title | Shape Memory Material And Method Of Making The Same |
---|---|
Granted Patent | US 7306683 |
Granted Date | 2007-12-11 |
Priority Date | 2004-04-19 US 11/827665 2003-04-18 US 10/464083P |
Inventors | |
Issue Date | 2007 |
Citation | US Patent 7306683. Washington, DC: US Patent and Trademark Office (USPTO), 2007 How to Cite? |
Abstract | The Present Invention Relates Generally To A Shape Memory And/Or Super-Elastic Material, Such As A Nickel Titanium Alloy. Additionally Or Alternatively, The Present Invention Relates To A Super-Elastic Or Pseudo-Elastic Material That Has An Initial Transition Temperature Af Above A Body Temperature. The Shape Memory Material Can Have A Super-Elasticity Or Pseudo-Elasticity Property At A Temperature Below The Initial Transition Temperature Af Of The Material. For Example, The Shape Memory Material Can Have Its Workable Temperature For Producing Super-Elasticity Or Pseudo-Elasticity Of About 0 Deg C. To 15 Deg C. Below The Initial Transition Temperature Af. The Shape Memory Material Can Be Malleable At A Room Temperature, And Become Super-Elastic Or Pseudo-Elastic At A Body Temperature.; In Addition, The Present Invention Relates To A Method Of Making A Shape Memory Or A Super-Elastic Material. The Treatment Protocols Can Include But Not Limited To Thermo-Mechanical, Thermo-Mechanical, Radiation, And Ternary Alloying Treatments. |
Persistent Identifier | http://hdl.handle.net/10722/173818 |
References |
DC Field | Value | Language |
---|---|---|
dc.date.accessioned | 2012-11-02T06:19:26Z | - |
dc.date.available | 2012-11-02T06:19:26Z | - |
dc.date.issued | 2007 | - |
dc.identifier.citation | US Patent 7306683. Washington, DC: US Patent and Trademark Office (USPTO), 2007 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/173818 | - |
dc.description.abstract | The Present Invention Relates Generally To A Shape Memory And/Or Super-Elastic Material, Such As A Nickel Titanium Alloy. Additionally Or Alternatively, The Present Invention Relates To A Super-Elastic Or Pseudo-Elastic Material That Has An Initial Transition Temperature Af Above A Body Temperature. The Shape Memory Material Can Have A Super-Elasticity Or Pseudo-Elasticity Property At A Temperature Below The Initial Transition Temperature Af Of The Material. For Example, The Shape Memory Material Can Have Its Workable Temperature For Producing Super-Elasticity Or Pseudo-Elasticity Of About 0 Deg C. To 15 Deg C. Below The Initial Transition Temperature Af. The Shape Memory Material Can Be Malleable At A Room Temperature, And Become Super-Elastic Or Pseudo-Elastic At A Body Temperature.; In Addition, The Present Invention Relates To A Method Of Making A Shape Memory Or A Super-Elastic Material. The Treatment Protocols Can Include But Not Limited To Thermo-Mechanical, Thermo-Mechanical, Radiation, And Ternary Alloying Treatments. | en_HK |
dc.relation.isreferencedby | WO 2009114357 (A2) 2009-09-17 | en_HK |
dc.relation.isreferencedby | WO 2009114357 (A3) 2009-12-10 | en_HK |
dc.title | Shape Memory Material And Method Of Making The Same | en_HK |
dc.type | Patent | en_US |
dc.identifier.email | Cheung, KMC=ken-cheung@hku.hk | - |
dc.identifier.email | Lu, WW=wwlu@hkusua.hku.hk | - |
dc.identifier.email | Yeung, KWK=wkkyeung@hku.hk | - |
dc.identifier.authority | Cheung, KMC:rp00387 | - |
dc.identifier.authority | Lu, WW:rp00411 | - |
dc.identifier.authority | Yeung, KWK:rp00309 | - |
dc.description.nature | published_or_final_version | en_US |
dc.contributor.inventor | Cheung, KMC | - |
dc.contributor.inventor | Lu, WW | - |
dc.contributor.inventor | Yeung, KWK | - |
patents.identifier.application | US 11/827665 | en_HK |
patents.identifier.granted | US 7306683 | en_HK |
patents.description.assignee | Versitech Ltd [Cn]; Univ City Hong Kong [Cn] | en_HK |
patents.description.country | United States of America | en_HK |
patents.date.publication | 2004-12-30 | en_HK |
patents.date.granted | 2007-12-11 | en_HK |
dc.relation.references | US 5092941 (A) 1992-03-03 | en_HK |
dc.relation.references | US 5190546 (A) 1993-03-02 | en_HK |
dc.relation.references | US 5611874 (A) 1997-03-18 | en_HK |
dc.relation.references | US 5641364 (A) 1997-06-24 | en_HK |
dc.relation.references | US 6096175 (A) 2000-08-01 | en_HK |
dc.relation.references | US 6375458 (B1) 2002-04-23 | en_HK |
dc.relation.references | US 2001056296 (A1) 2001-12-27 | en_HK |
dc.relation.references | US 6416544 (B2) 2002-07-09 | en_HK |
dc.relation.references | US 2004216816 (A1) 2004-11-04 | en_HK |
dc.relation.references | US 7192496 (B2) 2007-03-20 | en_HK |
dc.relation.references | US 2002129822 (A1) 2002-09-19 | en_HK |
dc.relation.references | US 6830588 (B2) 2004-12-14 | en_HK |
dc.relation.references | JP 59028548 (A) 1984-02-15 | en_HK |
dc.relation.references | JP 61059390 (B) 1986-12-16 | en_HK |
dc.relation.references | JP 60103166 (A) 1985-06-07 | en_HK |
dc.relation.references | JP 61057389 (B) 1986-12-06 | en_HK |
dc.relation.references | JP 1484198 (C) 1989-02-27 | en_HK |
dc.relation.references | JP 61276947 (A) 1986-12-06 | en_HK |
dc.relation.references | JP 4141562 (A) 1992-05-15 | en_HK |
dc.relation.references | JP 3321735 (B2) 2002-09-09 | en_HK |
dc.relation.references | US 4170990 (A) 1979-10-16 | en_HK |
dc.relation.references | US 6127597 (A) 2000-10-03 | en_HK |
patents.identifier.hkutechid | O&T-2003-00105-1 | en_HK |
patents.date.application | 2004-04-19 | en_HK |
patents.date.priority | 2004-04-19 US 11/827665 | en_HK |
patents.date.priority | 2003-04-18 US 10/464083P | en_HK |
patents.description.cc | US | en_HK |
patents.identifier.publication | US 20040265614 | en_HK |
patents.relation.family | CN 1806060 (A) 2006-07-19 | en_HK |
patents.relation.family | CN 100432257 (C) 2008-11-12 | en_HK |
patents.relation.family | CN 101333611 (A) 2008-12-31 | en_HK |
patents.relation.family | EP 1629133 (A1) 2006-03-01 | en_HK |
patents.relation.family | JP 2006523770 (A) 2006-10-19 | en_HK |
patents.relation.family | US 2004265614 (A1) 2004-12-30 | en_HK |
patents.relation.family | US 7306683 (B2) 2007-12-11 | en_HK |
patents.relation.family | US 2004230193 (A1) 2004-11-18 | en_HK |
patents.relation.family | US 7695471 (B2) 2010-04-13 | en_HK |
patents.relation.family | US 2008053575 (A1) 2008-03-06 | en_HK |
patents.relation.family | US 7789975 (B2) 2010-09-07 | en_HK |
patents.relation.family | WO 2004092431 (A1) 2004-10-28 | en_HK |
patents.description.kind | B2 | en_HK |
patents.type | Patent_granted | en_HK |