File Download
Patent History
- ApplicationUS /927816 2007-10-30
- PublicationUS 20080053575 2008-03-06
- GrantedUS 7789975 2010-09-07
Patent Family
- CN 1806060 (A) 2006-07-19
- CN 100432257 (C) 2008-11-12
- CN 101333611 (A) 2008-12-31
- EP 1629133 (A1) 2006-03-01
- JP 2006523770 (A) 2006-10-19
- US 2004265614 (A1) 2004-12-30
- US 7306683 (B2) 2007-12-11
- US 2004230193 (A1) 2004-11-18
- US 7695471 (B2) 2010-04-13
- US 2008053575 (A1) 2008-03-06
- US 7789975 (B2) 2010-09-07
- WO 2004092431 (A1) 2004-10-28
Supplementary
-
Citations:
- Appears in Collections:
granted patent: Shape Memory Material And Method Of Making The Same
Title | Shape Memory Material And Method Of Making The Same |
---|---|
Granted Patent | US 7789975 |
Granted Date | 2010-09-07 |
Priority Date | 2007-10-30 US /927816 2004-04-19 US 11/827665 2003-04-18 US 10/464083P |
Inventors | |
Issue Date | 2010 |
Citation | US Patent 7789975. Washington, DC: US Patent and Trademark Office (USPTO), 2010 How to Cite? |
Abstract | The Present Invention Relates Generally To A Shape Memory And/Or Super-Elastic Material, Such As A Nickel Titanium Alloy. Additionally Or Alternatively, The Present Invention Relates To A Super-Elastic Or Pseudo-Elastic Material That Has An Initial Transition Temperature Af Above A Body Temperature. The Shape Memory Material Can Have A Super-Elasticity Or Pseudo-Elasticity Property At A Temperature Below The Initial Transition Temperature Af Of The Material. For Example, The Shape Memory Material Can Have Its Workable Temperature For Producing Super-Elasticity Or Pseudo-Elasticity Of About 0 Deg C. To 15 Deg C. Below The Initial Transition Temperature Af. The Shape Memory Material Can Be Malleable At A Room Temperature, And Become Super-Elastic Or Pseudo-Elastic At A Body Temperature.; In Addition, The Present Invention Relates To A Method Of Making A Shape Memory Or A Super-Elastic Material. The Treatment Protocols Can Include But Not Limited To Thermo-Mechanical, Thermo-Mechanical, Radiation, And Ternary Alloying Treatments. |
Persistent Identifier | http://hdl.handle.net/10722/142170 |
References |
DC Field | Value | Language |
---|---|---|
dc.date.accessioned | 2011-10-19T06:33:22Z | - |
dc.date.available | 2011-10-19T06:33:22Z | - |
dc.date.issued | 2010 | - |
dc.identifier.citation | US Patent 7789975. Washington, DC: US Patent and Trademark Office (USPTO), 2010 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/142170 | - |
dc.description.abstract | The Present Invention Relates Generally To A Shape Memory And/Or Super-Elastic Material, Such As A Nickel Titanium Alloy. Additionally Or Alternatively, The Present Invention Relates To A Super-Elastic Or Pseudo-Elastic Material That Has An Initial Transition Temperature Af Above A Body Temperature. The Shape Memory Material Can Have A Super-Elasticity Or Pseudo-Elasticity Property At A Temperature Below The Initial Transition Temperature Af Of The Material. For Example, The Shape Memory Material Can Have Its Workable Temperature For Producing Super-Elasticity Or Pseudo-Elasticity Of About 0 Deg C. To 15 Deg C. Below The Initial Transition Temperature Af. The Shape Memory Material Can Be Malleable At A Room Temperature, And Become Super-Elastic Or Pseudo-Elastic At A Body Temperature.; In Addition, The Present Invention Relates To A Method Of Making A Shape Memory Or A Super-Elastic Material. The Treatment Protocols Can Include But Not Limited To Thermo-Mechanical, Thermo-Mechanical, Radiation, And Ternary Alloying Treatments. | en_HK |
dc.title | Shape Memory Material And Method Of Making The Same | en_HK |
dc.type | Patent | en_US |
dc.identifier.email | Cheung, Kenneth Man Chee:ken-cheung@hku.hk | en_US |
dc.identifier.email | Lu, William Weijia:wwlu@hkusua.hku.hk | en_US |
dc.identifier.email | Yeung, Kelvin Wai Kwok:wkkyeung@hku.hk | en_US |
dc.identifier.authority | Lu, William Weijia=rp00411 | en_US |
dc.description.nature | published_or_final_version | - |
dc.contributor.inventor | Cheung, Kenneth Man Chee | en_US |
dc.contributor.inventor | Yeung, Kelvin Wai Kwok | en_US |
dc.contributor.inventor | Lu, William Weijia | en_US |
dc.contributor.inventor | Chung, Chi Yuen | en_US |
patents.identifier.application | US /927816 | en_HK |
patents.identifier.granted | US 7789975 | en_HK |
patents.description.assignee | Versitech Ltd [Cn]; Univ City Hong Kong [Cn] | en_HK |
patents.description.country | United States of America | en_HK |
patents.date.publication | 2008-03-06 | en_HK |
patents.date.granted | 2010-09-07 | en_HK |
dc.relation.references | US 5514115 (A) 1996-05-07 | en_HK |
dc.relation.references | US 5573508 (A) 1996-11-12 | en_HK |
dc.relation.references | US 5931819 (A) 1999-08-03 | en_HK |
dc.relation.references | US 5964770 (A) 1999-10-12 | en_HK |
dc.relation.references | US 2002005047 (A1) 2002-01-17 | en_HK |
dc.relation.references | US 6675610 (B2) 2004-01-13 | en_HK |
dc.relation.references | US 2004193140 (A1) 2004-09-30 | en_HK |
dc.relation.references | US 7001369 (B2) 2006-02-21 | en_HK |
dc.relation.references | US 2002010481 (A1) 2002-01-24 | en_HK |
dc.relation.references | US 6790218 (B2) 2004-09-14 | en_HK |
dc.relation.references | US 2002052627 (A1) 2002-05-02 | en_HK |
dc.relation.references | US 6602272 (B2) 2003-08-05 | en_HK |
dc.relation.references | US 4170990 (A) 1979-10-16 | en_HK |
dc.relation.references | US 5092941 (A) 1992-03-03 | en_HK |
dc.relation.references | US 5190546 (A) 1993-03-02 | en_HK |
dc.relation.references | US 5611874 (A) 1997-03-18 | en_HK |
dc.relation.references | US 5641364 (A) 1997-06-24 | en_HK |
dc.relation.references | US 6096175 (A) 2000-08-01 | en_HK |
dc.relation.references | US 6127597 (A) 2000-10-03 | en_HK |
patents.identifier.hkutechid | O&T-2003-00105-2 | en_US |
patents.date.application | 2007-10-30 | en_HK |
patents.date.priority | 2007-10-30 US /927816 | en_HK |
patents.date.priority | 2004-04-19 US 11/827665 | en_HK |
patents.date.priority | 2003-04-18 US 10/464083P | en_HK |
patents.description.cc | US | en_HK |
patents.identifier.publication | US 20080053575 | en_HK |
patents.relation.family | CN 1806060 (A) 2006-07-19 | en_HK |
patents.relation.family | CN 100432257 (C) 2008-11-12 | en_HK |
patents.relation.family | CN 101333611 (A) 2008-12-31 | en_HK |
patents.relation.family | EP 1629133 (A1) 2006-03-01 | en_HK |
patents.relation.family | JP 2006523770 (A) 2006-10-19 | en_HK |
patents.relation.family | US 2004265614 (A1) 2004-12-30 | en_HK |
patents.relation.family | US 7306683 (B2) 2007-12-11 | en_HK |
patents.relation.family | US 2004230193 (A1) 2004-11-18 | en_HK |
patents.relation.family | US 7695471 (B2) 2010-04-13 | en_HK |
patents.relation.family | US 2008053575 (A1) 2008-03-06 | en_HK |
patents.relation.family | US 7789975 (B2) 2010-09-07 | en_HK |
patents.relation.family | WO 2004092431 (A1) 2004-10-28 | en_HK |
patents.description.kind | B2 | en_HK |
patents.type | Patent_granted | en_HK |