Showing results 1 to 4 of 4
Title | Author(s) | Issue Date | |
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Behavior of copper removal by CMP and its correlation to deposit structure and impurity content Journal:Journal of the Electrochemical Society | 2008 | ||
Effect of impurity and illumination on copper oxidation after chemical mechanical polishing Journal:Journal of the Electrochemical Society | 2008 | ||
Impurities induced localized corrosion between copper and tantalum nitride during chemical mechanical planarization Journal:Electrochemical and Solid-State Letters | 2007 | ||
Void defect reduction after chemical mechanical planarization of trenches filled by direct/pulse plating Journal:Journal of the Electrochemical Society | 2007 |