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Patent History
- ApplicationEP20020257993 2002-11-20
- PublicationEP 1314970 2007-01-10
- Granted1314970 2007-01-10
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- Appears in Collections:
published patent: Method For Measuring Elastic Properties
| Title | Method For Measuring Elastic Properties |
|---|---|
| Granted Patent | 1314970 |
| Granted Date | 2007-01-10 |
| Priority Date | 2001-11-20 US 09/331751P |
| Inventors | |
| Issue Date | 2007 |
| Citation | EP Published Patent application 1314970. European Patent Office (EPO), Escapenet, 2007 How to Cite? |
| Abstract | This Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System. |
| Persistent Identifier | http://hdl.handle.net/10722/142145 |
| DC Field | Value | Language |
|---|---|---|
| dc.date.accessioned | 2011-10-19T06:30:19Z | - |
| dc.date.available | 2011-10-19T06:30:19Z | - |
| dc.date.issued | 2007 | - |
| dc.identifier.citation | EP Published Patent application 1314970. European Patent Office (EPO), Escapenet, 2007 | en_HK |
| dc.identifier.uri | http://hdl.handle.net/10722/142145 | - |
| dc.description.abstract | This Invention Relates To A Method For Measuring Elastic Modulus Of A Sample Object. This Invention Also Relates To A Method For Correcting Creep Effects In The Modulus Measurement. The Error Due To Creep In The Apparent Contact Compliance Is Equal To The Ratio Of The Indenter Displacement Rate At The End Of The Load Hold To The Unloading Rate. Determination Of This Error Term And Deduction Of It From The Measured Contact Compliance Can Be Easily Done At A Low Cost By Modifying The Data Analysis Software In Any Commercial Depth-Sensing Indentation System. | en_HK |
| dc.title | Method For Measuring Elastic Properties | en_HK |
| dc.type | Patent | en_US |
| dc.identifier.email | Ngan, Alfonso Hing Wan:hwngan@hkucc.hku.hk | en_US |
| dc.identifier.authority | Ngan, Alfonso Hing Wan=rp00225 | en_US |
| dc.description.nature | published_or_final_version | - |
| dc.contributor.inventor | Feng, Gang | en_HK |
| dc.contributor.inventor | Ngan, Alfonso Hing Wan | en_HK |
| patents.identifier.application | EP20020257993 | en_HK |
| patents.identifier.granted | 1314970 | en_US |
| patents.description.assignee | Univ Hong Kong [Cn] | en_HK |
| patents.description.country | European Patent Office | en_HK |
| patents.date.publication | 2007-01-10 | en_HK |
| patents.date.granted | 2007-01-10 | en_US |
| patents.identifier.hkutechid | ME-2001-00058-2 | en_US |
| patents.identifier.hkutechid | ME-2001-00058-3 | - |
| patents.identifier.hkutechid | ME-2001-00058-4 | - |
| patents.date.application | 2002-11-20 | en_HK |
| patents.date.priority | 2001-11-20 US 09/331751P | en_HK |
| patents.description.cc | EP | en_HK |
| patents.identifier.publication | EP 1314970 | en_HK |
| patents.relation.family | EP 1314970 (A2) 2003-05-28 | en_HK |
| patents.relation.family | US 2003094034 (A1) 2003-05-22 | en_HK |
| patents.relation.family | US 6883367 (B2) 2005-04-26 | en_HK |
| patents.relation.family | US 2005066702 (A1) 2005-03-31 | en_HK |
| patents.description.kind | B1 | en_HK |
| patents.type | Patent_published | en_HK |