Showing results 1 to 7 of 7
| Title | Author(s) | Issue Date | |
|---|---|---|---|
An Experimental Study on a Barrier-Less Cu Interconnect Scheme With Polyimide Insulator for Cost-Effective 3-D Packaging Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology | 13-May-2025 | ||
| 2023 | |||
Establishment and Verification of Equivalent Circuit Model for Coaxially-Shielded TSV with Mixed Dielectric Layer Journal:Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology | 2023 | ||
| 2022 | |||
| 2023 | |||
| 2022 | |||
| 2023 |