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  Patent History
  • Application
    US 11/797621 2007-05-04
  • Publication
    US 2007265789 2007-11-15
Supplementary

published patent: Real-time S-parameter imager

TitleReal-time S-parameter imager
Priority Date2007-05-04 US 11/797621
2004-07-14 US 10/890723
Inventors
Issue Date2007
Citation
US Published patent application US 2007265789. Washington, DC: US Patent and Trademark Office (USPTO), 2007 How to Cite?
AbstractDisclosed is a fully automated system capable of producing high quality real-time S-parameter images. It is a useful and versatile tool in Material Science and Solid State Technology for determining the location of subsurface defect types and concentrations on bulk-materials as well as thin-films. The system is also useful in locating top surface metallizations and structures in solid state devices. This imaging system operates by scanning the sample surface with either a small positron source (<22>Na) or a focused positron beam. The system also possesses another two major parts, namely electronic instrumentation and stand-alone imaging software. In the system, the processing time and use of system resources are constantly monitored and optimized for producing high resolution S-parameter image of the sample in real time with a general purpose personal computer.; The system software possesses special features with its embedded specialized algorithms and techniques that provide the user with adequate freedom for analyzing various aspects of the image in order to obtain a clear inference of the defect profile while at the same time keeping automatic track on the instrumentation and hardware settings. The system is useful for semiconductor and metal samples, giving excellent quality images of the subsurface defect profile and has applications for biological samples.
Persistent Identifierhttp://hdl.handle.net/10722/176944

 

DC FieldValueLanguage
dc.date.accessioned2012-11-30T08:38:48Z-
dc.date.available2012-11-30T08:38:48Z-
dc.date.issued2007-
dc.identifier.citationUS Published patent application US 2007265789. Washington, DC: US Patent and Trademark Office (USPTO), 2007en_HK
dc.identifier.urihttp://hdl.handle.net/10722/176944-
dc.description.abstractDisclosed is a fully automated system capable of producing high quality real-time S-parameter images. It is a useful and versatile tool in Material Science and Solid State Technology for determining the location of subsurface defect types and concentrations on bulk-materials as well as thin-films. The system is also useful in locating top surface metallizations and structures in solid state devices. This imaging system operates by scanning the sample surface with either a small positron source (<22>Na) or a focused positron beam. The system also possesses another two major parts, namely electronic instrumentation and stand-alone imaging software. In the system, the processing time and use of system resources are constantly monitored and optimized for producing high resolution S-parameter image of the sample in real time with a general purpose personal computer.; The system software possesses special features with its embedded specialized algorithms and techniques that provide the user with adequate freedom for analyzing various aspects of the image in order to obtain a clear inference of the defect profile while at the same time keeping automatic track on the instrumentation and hardware settings. The system is useful for semiconductor and metal samples, giving excellent quality images of the subsurface defect profile and has applications for biological samples.en_HK
dc.relation.isreferencedbyUS 2010322505 (A1) 2010-12-23en_HK
dc.relation.isreferencedbyUS 8053724 (B2) 2011-11-08en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License For Public Patent Documentsen_US
dc.titleReal-time S-parameter imageren_HK
dc.typePatenten_US
dc.description.naturepublished_or_final_versionen_US
dc.contributor.inventorNaik Pranab Sabitruen_HK
dc.contributor.inventorBeling Christopher Daviden_HK
dc.contributor.inventorFung, SHYen_HK
patents.identifier.applicationUS 11/797621en_HK
patents.description.assigneeUNIV HONG KONGen_HK
patents.description.countryUnited States of Americaen_HK
patents.date.publication2007-11-15en_HK
patents.date.application2007-05-04en_HK
patents.date.priority2007-05-04 US 11/797621en_HK
patents.date.priority2004-07-14 US 10/890723en_HK
patents.description.ccUSen_HK
patents.identifier.publicationUS 2007265789en_HK
patents.relation.familyUS 2006011831 (A1) 2006-01-19en_HK
patents.relation.familyUS 7420166 (B2) 2008-09-02en_HK
patents.relation.familyUS 2007265789 (A1) 2007-11-15en_HK
patents.relation.familyUS 7781732 (B2) 2010-08-24en_HK
patents.relation.familyUS 2010322505 (A1) 2010-12-23en_HK
patents.relation.familyUS 8053724 (B2) 2011-11-08en_HK
patents.description.kindA1en_HK
patents.typePatent_publisheden_HK

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