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  Patent History
  • Application
    US 12/816218 2010-06-15
  • Publication
    US 20100322505 2010-12-23
  • Granted
    US 8053724 2011-11-08
Supplementary

granted patent: Real-Time S-Parameter Imager

TitleReal-Time S-Parameter Imager
Granted PatentUS 8053724
Granted Date2011-11-08
Priority Date2010-06-15 US 12/816218
2007-05-04 US 11/797621
2004-07-14 US 11/890723
Inventors
Issue Date2011
Citation
US Patent 8053724. Washington, DC: US Patent and Trademark Office (USPTO), 2011 How to Cite?
AbstractAn Instrumentation Setup Is Provided To Process Electronic Signals In A Positron Imager Functioning In Two Different Modes Of Operations For Scanning Both Bulk And Thin Film Materials. According To One Part Of An Implementation, An Instrumentation Setup Comprises An Xy-Rastering Stepper Motor Apparatus Coupled With Lvdts (Linear Variable Differential Transformers), And Nuclear Signal Processing And High Speed Data Acquisition Sections. Imaging Of Bulk Material Samples May Be Enabled By Scanning A Positron Point Source Across A Surface Of Samples. In Another Part Of The Irnplenientation, The Instrumentation Setup May Comprise An Electromagnetic Deflection Control Arrangement In Conjunction With A Guided Monoenergetic Positron Beam Together With Nuclear Signal Processing And Data Acquisition Arrangements.; This Part Of The Implementation May Scan And Produce Images For Thin Film Samples. The Instrumentation Setup Is Capable Of Producing High Quality Real-Time S-Parameter Images.
Persistent Identifierhttp://hdl.handle.net/10722/173823
References

 

DC FieldValueLanguage
dc.date.accessioned2012-11-02T06:19:27Z-
dc.date.available2012-11-02T06:19:27Z-
dc.date.issued2011-
dc.identifier.citationUS Patent 8053724. Washington, DC: US Patent and Trademark Office (USPTO), 2011en_HK
dc.identifier.urihttp://hdl.handle.net/10722/173823-
dc.description.abstractAn Instrumentation Setup Is Provided To Process Electronic Signals In A Positron Imager Functioning In Two Different Modes Of Operations For Scanning Both Bulk And Thin Film Materials. According To One Part Of An Implementation, An Instrumentation Setup Comprises An Xy-Rastering Stepper Motor Apparatus Coupled With Lvdts (Linear Variable Differential Transformers), And Nuclear Signal Processing And High Speed Data Acquisition Sections. Imaging Of Bulk Material Samples May Be Enabled By Scanning A Positron Point Source Across A Surface Of Samples. In Another Part Of The Irnplenientation, The Instrumentation Setup May Comprise An Electromagnetic Deflection Control Arrangement In Conjunction With A Guided Monoenergetic Positron Beam Together With Nuclear Signal Processing And Data Acquisition Arrangements.; This Part Of The Implementation May Scan And Produce Images For Thin Film Samples. The Instrumentation Setup Is Capable Of Producing High Quality Real-Time S-Parameter Images.en_HK
dc.rightsCreative Commons: Attribution 3.0 Hong Kong License For Public Patent Documentsen_US
dc.titleReal-Time S-Parameter Imageren_HK
dc.typePatenten_US
dc.identifier.authorityBeling, CD:rp00660-
dc.description.naturepublished_or_final_versionen_US
dc.contributor.inventorNaik, Sabitru Pranab-
dc.contributor.inventorBeling, CD-
dc.contributor.inventorFung, H Y Stevenson-
patents.identifier.applicationUS 12/816218en_HK
patents.identifier.grantedUS 8053724en_HK
patents.description.assigneeUniv Hong Kong [Hk]en_HK
patents.description.countryUnited States of Americaen_HK
patents.date.publication2010-12-23en_HK
patents.date.granted2011-11-08en_HK
dc.relation.referencesUS 5870051 (A) 1999-02-09en_HK
dc.relation.referencesUS 5873054 (A) 1999-02-16en_HK
dc.relation.referencesUS 3825759 (A) 1974-07-23en_HK
dc.relation.referencesUS 4064438 (A) 1977-12-20en_HK
dc.relation.referencesUS 6043489 (A) 2000-03-28en_HK
dc.relation.referencesUS 2006011831 (A1) 2006-01-19en_HK
dc.relation.referencesUS 7420166 (B2) 2008-09-02en_HK
dc.relation.referencesUS 2007265789 (A1) 2007-11-15en_HK
dc.relation.referencesUS 7781732 (B2) 2010-08-24en_HK
patents.identifier.hkutechidPhy-2004-00149-3en_HK
patents.date.application2010-06-15en_HK
patents.date.priority2010-06-15 US 12/816218en_HK
patents.date.priority2007-05-04 US 11/797621en_HK
patents.date.priority2004-07-14 US 11/890723en_HK
patents.description.ccUSen_HK
patents.identifier.publicationUS 20100322505en_HK
patents.relation.familyUS 2006011831 (A1) 2006-01-19en_HK
patents.relation.familyUS 7420166 (B2) 2008-09-02en_HK
patents.relation.familyUS 2007265789 (A1) 2007-11-15en_HK
patents.relation.familyUS 7781732 (B2) 2010-08-24en_HK
patents.relation.familyUS 2010322505 (A1) 2010-12-23en_HK
patents.relation.familyUS 8053724 (B2) 2011-11-08en_HK
patents.description.kindB2en_HK
patents.typePatent_granteden_HK

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