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Conference Paper: Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

TitleEffect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
Authors
Xie, JChung, DSwaminathan, MMcallister, MDeutsch, AJiang, LRubin, BJ
Issue Date2009
Citation
2009 Ieee 18Th Conference On Electrical Performance Of Electronic Packaging And Systems, Epeps '09, 2009, p. 113-116 How to Cite?
DOI: http://dx.doi.org/10.1109/EPEPS.2009.5338465
AbstractIn this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system. ©2009 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/91321
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorXie, Jen_HK
dc.contributor.authorChung, Den_HK
dc.contributor.authorSwaminathan, Men_HK
dc.contributor.authorMcallister, Men_HK
dc.contributor.authorDeutsch, Aen_HK
dc.contributor.authorJiang, Len_HK
dc.contributor.authorRubin, BJen_HK
dc.date.accessioned2010-09-17T10:17:00Z-
dc.date.available2010-09-17T10:17:00Z-
dc.date.issued2009en_HK
dc.identifier.citation2009 Ieee 18Th Conference On Electrical Performance Of Electronic Packaging And Systems, Epeps '09, 2009, p. 113-116en_HK
dc.identifier.urihttp://hdl.handle.net/10722/91321-
dc.description.abstractIn this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system. ©2009 IEEE.en_HK
dc.languageengen_HK
dc.relation.ispartof2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09en_HK
dc.titleEffect of system components on electrical and thermal characteristics for power delivery networks in 3D system integrationen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailJiang, L:ljiang@eee.hku.hken_HK
dc.identifier.authorityJiang, L=rp01338en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1109/EPEPS.2009.5338465en_HK
dc.identifier.scopuseid_2-s2.0-74549131048en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-74549131048&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.spage113en_HK
dc.identifier.epage116en_HK
dc.identifier.scopusauthoridXie, J=7402994229en_HK
dc.identifier.scopusauthoridChung, D=9533916800en_HK
dc.identifier.scopusauthoridSwaminathan, M=7103353366en_HK
dc.identifier.scopusauthoridMcallister, M=7102448103en_HK
dc.identifier.scopusauthoridDeutsch, A=7102025083en_HK
dc.identifier.scopusauthoridJiang, L=36077777200en_HK
dc.identifier.scopusauthoridRubin, BJ=7201761344en_HK

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