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Patent History
- ApplicationUS 10/435578 2003-05-09
- PublicationUS 20040222186 2004-11-11
- GrantedUS 6943550 2005-09-13
Patent Family
Supplementary
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Citations:
- Appears in Collections:
granted patent: High Temperature Superconductor Tape Rf Coil For Magnetic Resonance Imaging
Title | High Temperature Superconductor Tape Rf Coil For Magnetic Resonance Imaging |
---|---|
Granted Patent | US 6943550 |
Granted Date | 2005-09-13 |
Priority Date | 2003-05-09 US 10/435578 |
Inventors | |
Issue Date | 2005 |
Citation | US Patent 6943550. Washington, DC: US Patent and Trademark Office (USPTO), 2005 How to Cite? |
Abstract | A Hts Rf Coil Is Disclosed Having At Least A Factor Of Three Improvement In The Snr Over A Comparable Copper Coil And At Least A Factor Of Six Improvement In Q Over A Comparable Copper Coil. A Commercially Available Hts Tape Is Formed Into A Loop. High-Q Capacitors Are Soldered Across The Loop Ends. The Silver Sheath Covering The Tape Is Removed Through Chemical Etching. The Coil Is Placed In A Holder For Mechanical Support And Protection And Covered With A Cover Having Through Holes Enabling The Coolant To Directly Contact The Hts Coil. |
Persistent Identifier | http://hdl.handle.net/10722/46524 |
References |
DC Field | Value | Language |
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dc.date.accessioned | 2007-10-30T06:51:59Z | - |
dc.date.available | 2007-10-30T06:51:59Z | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | US Patent 6943550. Washington, DC: US Patent and Trademark Office (USPTO), 2005 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/46524 | - |
dc.description.abstract | A Hts Rf Coil Is Disclosed Having At Least A Factor Of Three Improvement In The Snr Over A Comparable Copper Coil And At Least A Factor Of Six Improvement In Q Over A Comparable Copper Coil. A Commercially Available Hts Tape Is Formed Into A Loop. High-Q Capacitors Are Soldered Across The Loop Ends. The Silver Sheath Covering The Tape Is Removed Through Chemical Etching. The Coil Is Placed In A Holder For Mechanical Support And Protection And Covered With A Cover Having Through Holes Enabling The Coolant To Directly Contact The Hts Coil. | en_HK |
dc.format.extent | 639045 bytes | - |
dc.format.extent | 5169 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.format.mimetype | text/plain | - |
dc.language | eng | en_HK |
dc.relation.isreferencedby | WO 2010104940 (A1) 2010-09-16 | en_HK |
dc.relation.isreferencedby | US 2007170922 (A1) 2007-07-26 | en_HK |
dc.relation.isreferencedby | US 7517834 (B2) 2009-04-14 | en_HK |
dc.title | High Temperature Superconductor Tape Rf Coil For Magnetic Resonance Imaging | en_HK |
dc.type | Patent | en_HK |
dc.description.nature | published_or_final_version | - |
dc.contributor.inventor | Cheng, FMC | en_HK |
dc.contributor.inventor | Lee, FKH | en_HK |
dc.contributor.inventor | Yang, ES | en_HK |
patents.identifier.application | US 10/435578 | en_HK |
patents.identifier.granted | US 6943550 | en_HK |
patents.description.assignee | Univ Hong Kong [Cn] | en_HK |
patents.description.country | United States of America | en_HK |
patents.date.publication | 2004-11-11 | en_HK |
patents.date.granted | 2005-09-13 | en_HK |
dc.relation.references | US 5565778 (A) 1996-10-15 | en_HK |
dc.relation.references | US 5585723 (A) 1996-12-17 | en_HK |
dc.relation.references | US 6054855 (A) 2000-04-25 | en_HK |
dc.relation.references | US 6169399 (B1) 2001-01-02 | en_HK |
dc.relation.references | US 6201392 (B1) 2001-03-13 | en_HK |
dc.relation.references | US 2003052682 (A1) 2003-03-20 | en_HK |
dc.relation.references | US 6556013 (B2) 2003-04-29 | en_HK |
dc.relation.references | US 5882536 (A) 1999-03-16 | en_HK |
patents.identifier.hkutechid | EEE-2002-00099 | - |
patents.date.application | 2003-05-09 | en_HK |
patents.date.priority | 2003-05-09 US 10/435578 | en_HK |
patents.description.cc | US | en_HK |
patents.identifier.publication | US 20040222186 | en_HK |
patents.relation.family | US 2004222186 (A1) 2004-11-11 | en_HK |
patents.relation.family | US 6943550 (B2) 2005-09-13 | en_HK |
patents.relation.family | WO 2004099805 (A1) 2004-11-18 | en_HK |
patents.description.kind | B2 | en_HK |
patents.type | Patent_granted | en_HK |