Browsing "Mechanical Engineering: Conference papers" by Author sun, cheng

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Showing results 1 to 11 of 11
TitleAuthor(s)Issue Date
Artificial plasmonic metamaterial fabricated by micro-stereolithography
Proceeding/Conference:American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)
2003
Characterization of drying techniques for micro-stereolithography
Proceeding/Conference:ASME International Mechanical Engineering Congress and Exposition, Proceedings
2001
Characterization of drying techniques for micro-stereolithography
Proceeding/Conference:American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)
2001
Fabrication and characterization of THz plasmonic filter
Proceeding/Conference:Proceedings of the IEEE Conference on Nanotechnology
2002
Nanolithography with a NSOM tip - Part II: Experiments
Proceeding/Conference:American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
2001
Optical silver superlens imaging below the diffraction limit
Proceeding/Conference:Materials Research Society Symposium Proceedings
2006
Photon transport and photochemical reaction in laser micro-stereolithography
Proceeding/Conference:Proceedings of the International Conference on Energy Conversion and Application (ICECA'2001)
2001
Process modeling of projection micro stereo lithography for three-dimensional MEMS
Proceeding/Conference:ASME International Mechanical Engineering Congress and Exposition, Proceedings
2001
Process modeling of projection micro stereo lithography for three-dimensional MEMS
Proceeding/Conference:American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)
2001
Stiction Problems in Releasing of 3D Microstructures and Its Solution
Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering
2003
Towards high-speed near-field scanning optical microscope
Proceeding/Conference:American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
2004