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Article: Exploring floor plan design to achieve indoor thermal comfort in public housing: An integrated heat graph and machine learning approach

TitleExploring floor plan design to achieve indoor thermal comfort in public housing: An integrated heat graph and machine learning approach
Authors
KeywordsFloor plan layout
Graph representation
Indoor thermal comfort
Interpretable machine learning
Public housing
Issue Date1-Mar-2025
PublisherElsevier
Citation
Building and Environment, 2025, v. 271 How to Cite?
AbstractIn densely populated regions, public housing constitutes a significant portion of residential buildings. Given its impact on public housing residents’ well-being, optimizing indoor thermal comfort (ITC) is important, especially in hot and humid climates. Traditional approaches to the optimization of floor plans rely heavily on designers’ experience and intuition. This research, in contrast, seeks empirical evidence for the impacts of floor plan design on ITC. It does so by employing graph theory to represent public housing floor plans, and then adopting the machine learning model XGBoost to interpret the complex interactions between graph variables and ITC indicators. We find that building layout considerations such as modularity, density, and connectivity have relatively more impact on ITC. Highly modular zoned designs, while improving overall comfort, often face challenges related to thermal stability. In contrast, low-density linear layouts in naturally ventilated environments can enhance comfort by improving airflow and heat dissipation. This research contributes to the development of efficient design strategies for public housing and provides an evidence-based research framework for future generative design.
Persistent Identifierhttp://hdl.handle.net/10722/355846
ISSN
2023 Impact Factor: 7.1
2023 SCImago Journal Rankings: 1.647
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorXu, Zihan-
dc.contributor.authorLu, Weisheng-
dc.contributor.authorPeng, Ziyu-
dc.contributor.authorHuang, Jianxiang-
dc.contributor.authorSchuldenfrei, Eric-
dc.date.accessioned2025-05-18T00:40:05Z-
dc.date.available2025-05-18T00:40:05Z-
dc.date.issued2025-03-01-
dc.identifier.citationBuilding and Environment, 2025, v. 271-
dc.identifier.issn0360-1323-
dc.identifier.urihttp://hdl.handle.net/10722/355846-
dc.description.abstractIn densely populated regions, public housing constitutes a significant portion of residential buildings. Given its impact on public housing residents’ well-being, optimizing indoor thermal comfort (ITC) is important, especially in hot and humid climates. Traditional approaches to the optimization of floor plans rely heavily on designers’ experience and intuition. This research, in contrast, seeks empirical evidence for the impacts of floor plan design on ITC. It does so by employing graph theory to represent public housing floor plans, and then adopting the machine learning model XGBoost to interpret the complex interactions between graph variables and ITC indicators. We find that building layout considerations such as modularity, density, and connectivity have relatively more impact on ITC. Highly modular zoned designs, while improving overall comfort, often face challenges related to thermal stability. In contrast, low-density linear layouts in naturally ventilated environments can enhance comfort by improving airflow and heat dissipation. This research contributes to the development of efficient design strategies for public housing and provides an evidence-based research framework for future generative design.-
dc.languageeng-
dc.publisherElsevier-
dc.relation.ispartofBuilding and Environment-
dc.subjectFloor plan layout-
dc.subjectGraph representation-
dc.subjectIndoor thermal comfort-
dc.subjectInterpretable machine learning-
dc.subjectPublic housing-
dc.titleExploring floor plan design to achieve indoor thermal comfort in public housing: An integrated heat graph and machine learning approach-
dc.typeArticle-
dc.identifier.doi10.1016/j.buildenv.2025.112609-
dc.identifier.scopuseid_2-s2.0-85216535200-
dc.identifier.volume271-
dc.identifier.eissn1873-684X-
dc.identifier.isiWOS:001419690400001-
dc.identifier.issnl0360-1323-

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