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Conference Paper: Object Alignment with Refocused Image Using Off-Axis Digital Holography

TitleObject Alignment with Refocused Image Using Off-Axis Digital Holography
Authors
KeywordsAlignment
Digital Holography
Refocus
Issue Date2021
PublisherSociety for Imaging Science and Technology. The Journal's web site is located at https://www.ingentaconnect.com/content/ist/ei
Citation
IS&T International Symposium on Electronic Imaging 2021: Intelligent Robotics and Industrial Applications using Computer Vision (IRIACV) 2021, Virtual Conference, 11-28 January 2021. In Electronic Imaging, Intelligent Robotics and Industrial Applications using Computer Vision 2021, p. 335-1-335-6 How to Cite?
AbstractIn the semiconductor industry, the integrated circuit density is getting higher, which leads to a smaller margin of error for the bonding process. Therefore, accurate adjustments before bonding are often necessary. An accurate image alignment under a vision system is usually required to fine-tune the bonding position. However, a considerable depth of focus is sacrificed for sufficient resolution of the object, limiting the optics operation range. Digital holographic microscopy with digital refocusing is applied as an enhancement to extend the depth of focus. The proposed algorithm merges the image alignment method with a refocusing algorithm to extend the image alignment capability with digital holography. Tested with simulated images, the proposed algorithm showed no significant deviation to simulated parameters. Also, the alignment result is robust among several test patterns. Moreover, the overall time is reasonable for industrial application.
DescriptionMachine Vision Analytics - no. IRIACV-335
Persistent Identifierhttp://hdl.handle.net/10722/304061

 

DC FieldValueLanguage
dc.contributor.authorHung, FH-
dc.contributor.authorLam, EYM-
dc.date.accessioned2021-09-23T08:54:42Z-
dc.date.available2021-09-23T08:54:42Z-
dc.date.issued2021-
dc.identifier.citationIS&T International Symposium on Electronic Imaging 2021: Intelligent Robotics and Industrial Applications using Computer Vision (IRIACV) 2021, Virtual Conference, 11-28 January 2021. In Electronic Imaging, Intelligent Robotics and Industrial Applications using Computer Vision 2021, p. 335-1-335-6-
dc.identifier.urihttp://hdl.handle.net/10722/304061-
dc.descriptionMachine Vision Analytics - no. IRIACV-335-
dc.description.abstractIn the semiconductor industry, the integrated circuit density is getting higher, which leads to a smaller margin of error for the bonding process. Therefore, accurate adjustments before bonding are often necessary. An accurate image alignment under a vision system is usually required to fine-tune the bonding position. However, a considerable depth of focus is sacrificed for sufficient resolution of the object, limiting the optics operation range. Digital holographic microscopy with digital refocusing is applied as an enhancement to extend the depth of focus. The proposed algorithm merges the image alignment method with a refocusing algorithm to extend the image alignment capability with digital holography. Tested with simulated images, the proposed algorithm showed no significant deviation to simulated parameters. Also, the alignment result is robust among several test patterns. Moreover, the overall time is reasonable for industrial application.-
dc.languageeng-
dc.publisherSociety for Imaging Science and Technology. The Journal's web site is located at https://www.ingentaconnect.com/content/ist/ei-
dc.relation.ispartofElectronic Imaging, Intelligent Robotics and Industrial Applications using Computer Vision 2021-
dc.relation.ispartofIS&T EI Conference Proceedings-
dc.subjectAlignment-
dc.subjectDigital Holography-
dc.subjectRefocus-
dc.titleObject Alignment with Refocused Image Using Off-Axis Digital Holography-
dc.typeConference_Paper-
dc.identifier.emailLam, EYM: elam@eee.hku.hk-
dc.identifier.authorityLam, EYM=rp00131-
dc.identifier.doi10.2352/ISSN.2470-1173.2021.6.IRIACV-335-
dc.identifier.scopuseid_2-s2.0-85111416318-
dc.identifier.hkuros325013-
dc.identifier.volume2021-
dc.identifier.spage335-1-
dc.identifier.epage335-6-
dc.publisher.placeUnited States-

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