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- Publisher Website: 10.1109/ISCAS.2014.6865156
- Scopus: eid_2-s2.0-84907380608
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Conference Paper: Device engineering and CMOS integration of nanoscale memristors
Title | Device engineering and CMOS integration of nanoscale memristors |
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Authors | |
Keywords | nanoimprint lithography nanoscale memristor SiOx memristor heterogeneous integration hybrid circuits multilayer memristors |
Issue Date | 2014 |
Citation | Proceedings - IEEE International Symposium on Circuits and Systems, 2014, p. 425-427 How to Cite? |
Abstract | Our group focuses on developing better nanoscale memristor with improved performance, understanding the underlying device physics, and exploring new applications for this novel device. This paper introduces our recent work on memristor device engineering and CMOS integration. We have fabricated the smallest memristors (8 nm × 8 nm) in a crossbar array, with each of the device consumes orders of magnitude lower energy per switch event than their larger counterparts. We have demonstrated that a very thin layer of chemically produced silicon oxide can be used to make memristors that only need ∼0.5 V to switch. We have also proved that with multiple oxides as switching layer, both high ON/OFF ratio and high endurance can be achieved in the same device. Finally, we successfully integrated planar memristors with CMOS substrates, implementing hybrid memristor-CMOS integrated circuit with lower switching voltages and more uniform performance. © 2014 IEEE. |
Persistent Identifier | http://hdl.handle.net/10722/286895 |
ISSN | 2023 SCImago Journal Rankings: 0.307 |
DC Field | Value | Language |
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dc.contributor.author | Pi, Shuang | - |
dc.contributor.author | Lin, Peng | - |
dc.contributor.author | Jiang, Hao | - |
dc.contributor.author | Li, Can | - |
dc.contributor.author | Xia, Qiangfei | - |
dc.date.accessioned | 2020-09-07T11:45:57Z | - |
dc.date.available | 2020-09-07T11:45:57Z | - |
dc.date.issued | 2014 | - |
dc.identifier.citation | Proceedings - IEEE International Symposium on Circuits and Systems, 2014, p. 425-427 | - |
dc.identifier.issn | 0271-4310 | - |
dc.identifier.uri | http://hdl.handle.net/10722/286895 | - |
dc.description.abstract | Our group focuses on developing better nanoscale memristor with improved performance, understanding the underlying device physics, and exploring new applications for this novel device. This paper introduces our recent work on memristor device engineering and CMOS integration. We have fabricated the smallest memristors (8 nm × 8 nm) in a crossbar array, with each of the device consumes orders of magnitude lower energy per switch event than their larger counterparts. We have demonstrated that a very thin layer of chemically produced silicon oxide can be used to make memristors that only need ∼0.5 V to switch. We have also proved that with multiple oxides as switching layer, both high ON/OFF ratio and high endurance can be achieved in the same device. Finally, we successfully integrated planar memristors with CMOS substrates, implementing hybrid memristor-CMOS integrated circuit with lower switching voltages and more uniform performance. © 2014 IEEE. | - |
dc.language | eng | - |
dc.relation.ispartof | Proceedings - IEEE International Symposium on Circuits and Systems | - |
dc.subject | nanoimprint lithography | - |
dc.subject | nanoscale memristor | - |
dc.subject | SiOx memristor | - |
dc.subject | heterogeneous integration | - |
dc.subject | hybrid circuits | - |
dc.subject | multilayer memristors | - |
dc.title | Device engineering and CMOS integration of nanoscale memristors | - |
dc.type | Conference_Paper | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1109/ISCAS.2014.6865156 | - |
dc.identifier.scopus | eid_2-s2.0-84907380608 | - |
dc.identifier.spage | 425 | - |
dc.identifier.epage | 427 | - |
dc.identifier.issnl | 0271-4310 | - |