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Conference Paper: Thermionic emission-based interconnecting layer featuring solvent resistance for monolithic tandem solar cells with solution-processed perovskites

TitleThermionic emission-based interconnecting layer featuring solvent resistance for monolithic tandem solar cells with solution-processed perovskites
Authors
Choy, WCHLi, CWANG, Z
Issue Date2019
Citation
The 6th Conference on Science and Technology of Emerging Solar Energy Materials, Beijing, China, 25-26 May 2019 How to Cite?
DescriptionInvited talks of young scientist
Persistent Identifierhttp://hdl.handle.net/10722/281561

 

DC FieldValueLanguage
dc.contributor.authorChoy, WCH-
dc.contributor.authorLi, C-
dc.contributor.authorWANG, Z-
dc.date.accessioned2020-03-17T10:06:55Z-
dc.date.available2020-03-17T10:06:55Z-
dc.date.issued2019-
dc.identifier.citationThe 6th Conference on Science and Technology of Emerging Solar Energy Materials, Beijing, China, 25-26 May 2019-
dc.identifier.urihttp://hdl.handle.net/10722/281561-
dc.descriptionInvited talks of young scientist-
dc.languageeng-
dc.relation.ispartofThe 6th Conference on Science and Technology of Emerging Solar Energy Materials, Beijing, China-
dc.relation.ispartof第六届新型太阳能电池材料科学与技术学术研讨会-
dc.titleThermionic emission-based interconnecting layer featuring solvent resistance for monolithic tandem solar cells with solution-processed perovskites-
dc.typeConference_Paper-
dc.identifier.emailChoy, WCH: chchoy@eee.hku.hk-
dc.identifier.authorityChoy, WCH=rp00218-
dc.identifier.hkuros302802-

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