File Download
Links for fulltext
(May Require Subscription)
- Publisher Website: 10.1109/EDSSC.2013.6628158
- Scopus: eid_2-s2.0-84890457123
Supplementary
-
Citations:
- Scopus: 0
- Appears in Collections:
Conference Paper: Recent development of surface integral equation solvers for multiscale interconnects and circuits
Title | Recent development of surface integral equation solvers for multiscale interconnects and circuits |
---|---|
Authors | |
Keywords | Computational electromagnetics Integral equation Interconnects Muitiscale Circuit modeling |
Issue Date | 2013 |
Publisher | IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000853 |
Citation | The 2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC 2013), Hong Kong, China, 3-5 June 2013. In Conference Proceedings, 2013, p. 1-2 How to Cite? |
Abstract | This paper presents a brief review and recent development of surface integral equation solvers for multiscale interconnects and circuits modeling. As the future production processes down to 5 nm and the operating frequency increases, both multi-scale and large-scale natures should be taken into account in the electromagnetic simulations. Fast, efficient, stable, and broadband integral equation based solvers become indispensable when millions or ten s of millions of unknowns might be involved in the simulation of the integrated circuit. Recent progress and our latest researches in the development of broadband fast electromagnetic solvers will be demonstrated. |
Persistent Identifier | http://hdl.handle.net/10722/189888 |
ISBN |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sun, S | en_US |
dc.contributor.author | Jiang, L | en_US |
dc.contributor.author | Chew, WC | en_US |
dc.date.accessioned | 2013-09-17T15:01:06Z | - |
dc.date.available | 2013-09-17T15:01:06Z | - |
dc.date.issued | 2013 | - |
dc.identifier.citation | The 2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC 2013), Hong Kong, China, 3-5 June 2013. In Conference Proceedings, 2013, p. 1-2 | en_US |
dc.identifier.isbn | 978-1-4673-2523-3 | - |
dc.identifier.uri | http://hdl.handle.net/10722/189888 | - |
dc.description.abstract | This paper presents a brief review and recent development of surface integral equation solvers for multiscale interconnects and circuits modeling. As the future production processes down to 5 nm and the operating frequency increases, both multi-scale and large-scale natures should be taken into account in the electromagnetic simulations. Fast, efficient, stable, and broadband integral equation based solvers become indispensable when millions or ten s of millions of unknowns might be involved in the simulation of the integrated circuit. Recent progress and our latest researches in the development of broadband fast electromagnetic solvers will be demonstrated. | - |
dc.language | eng | en_US |
dc.publisher | IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000853 | - |
dc.relation.ispartof | IEEE Conference on Electron Devices and Solid-State Circuits Proceedings | en_US |
dc.subject | Computational electromagnetics | - |
dc.subject | Integral equation | - |
dc.subject | Interconnects | - |
dc.subject | Muitiscale | - |
dc.subject | Circuit modeling | - |
dc.title | Recent development of surface integral equation solvers for multiscale interconnects and circuits | en_US |
dc.type | Conference_Paper | en_US |
dc.identifier.email | Sun, S: sunsheng@hku.hk | en_US |
dc.identifier.email | Jiang, L: jianglj@hku.hk | en_US |
dc.identifier.email | Chew, WC: wcchew@hkucc.hku.hk | en_US |
dc.identifier.authority | Sun, S=rp01431 | en_US |
dc.identifier.authority | Jiang, L=rp01338 | en_US |
dc.identifier.authority | Chew, WC=rp00656 | en_US |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1109/EDSSC.2013.6628158 | - |
dc.identifier.scopus | eid_2-s2.0-84890457123 | - |
dc.identifier.hkuros | 223624 | en_US |
dc.identifier.spage | 1 | - |
dc.identifier.epage | 2 | - |
dc.publisher.place | United States | - |
dc.customcontrol.immutable | sml 131031 | - |