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Conference Paper: Packaging modeling using fast broadband surface integral equation method

TitlePackaging modeling using fast broadband surface integral equation method
Authors
Qian, ZGChew, WC
Issue Date2008
Citation
Electrical Performance Of Electronic Packaging, Epep, 2008, p. 347-350 How to Cite?
DOI: http://dx.doi.org/10.1109/EPEP.2008.4675952
AbstractThe augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently. © 2008 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/183014
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorQian, ZGen_US
dc.contributor.authorChew, WCen_US
dc.date.accessioned2013-05-02T05:18:06Z-
dc.date.available2013-05-02T05:18:06Z-
dc.date.issued2008en_US
dc.identifier.citationElectrical Performance Of Electronic Packaging, Epep, 2008, p. 347-350en_US
dc.identifier.urihttp://hdl.handle.net/10722/183014-
dc.description.abstractThe augmented electric field integral equation with frequency scaling provides a stable formulation over broad frequency band. With the iterative solver and the mixed-form fast multipole algorithm, large scale packaging problems can be solved efficiently. © 2008 IEEE.en_US
dc.languageengen_US
dc.relation.ispartofElectrical Performance of Electronic Packaging, EPEPen_US
dc.titlePackaging modeling using fast broadband surface integral equation methoden_US
dc.typeConference_Paperen_US
dc.identifier.emailChew, WC: wcchew@hku.hken_US
dc.identifier.authorityChew, WC=rp00656en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/EPEP.2008.4675952en_US
dc.identifier.scopuseid_2-s2.0-58049108880en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-58049108880&selection=ref&src=s&origin=recordpageen_US
dc.identifier.spage347en_US
dc.identifier.epage350en_US
dc.identifier.scopusauthoridQian, ZG=9043842600en_US
dc.identifier.scopusauthoridChew, WC=36014436300en_US

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