File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Conference Paper: Complex structures modeling using equivalence principle algorithm

TitleComplex structures modeling using equivalence principle algorithm
Authors
Li, MKChew, WC
Issue Date2006
Citation
Electrical Performance Of Electronic Packaging, Epep, 2006, p. 339-342 How to Cite?
DOI: http://dx.doi.org/10.1109/EPEP.2006.321247
AbstractA equivalence principle algorithm using the method moments is introduced. Complex structures can be decomposed into smaller, simpler structures using simpler equivalence surface which will help the electromagnetic modeling of complex structures in electrical packages. ©2006 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/183005
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorLi, MKen_US
dc.contributor.authorChew, WCen_US
dc.date.accessioned2013-05-02T05:18:04Z-
dc.date.available2013-05-02T05:18:04Z-
dc.date.issued2006en_US
dc.identifier.citationElectrical Performance Of Electronic Packaging, Epep, 2006, p. 339-342en_US
dc.identifier.urihttp://hdl.handle.net/10722/183005-
dc.description.abstractA equivalence principle algorithm using the method moments is introduced. Complex structures can be decomposed into smaller, simpler structures using simpler equivalence surface which will help the electromagnetic modeling of complex structures in electrical packages. ©2006 IEEE.en_US
dc.languageengen_US
dc.relation.ispartofElectrical Performance of Electronic Packaging, EPEPen_US
dc.titleComplex structures modeling using equivalence principle algorithmen_US
dc.typeConference_Paperen_US
dc.identifier.emailChew, WC: wcchew@hku.hken_US
dc.identifier.authorityChew, WC=rp00656en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/EPEP.2006.321247en_US
dc.identifier.scopuseid_2-s2.0-50049095765en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-50049095765&selection=ref&src=s&origin=recordpageen_US
dc.identifier.spage339en_US
dc.identifier.epage342en_US
dc.identifier.scopusauthoridLi, MK=51964250200en_US
dc.identifier.scopusauthoridChew, WC=36014436300en_US

Export via OAI-PMH Interface in XML Formats

OR

Export to Other Non-XML Formats