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- Publisher Website: 10.1109/EPEP.2007.4387196
- Scopus: eid_2-s2.0-47949123260
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Conference Paper: Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis
Title | Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis |
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Authors | |
Issue Date | 2007 |
Citation | Ieee Topical Meeting On Electrical Performance Of Electronic Packaging, 2007, p. 337-342 How to Cite? |
Abstract | A parallel LU decomposition algorithm is presented to take advantage of the sparse impedance matrix produced by the reduced-coupling method. This algorithm allows rapid simulation of very large chip and packaging problems. A representative example is shown for a wide, on-chip data-bus that required one million surface unknowns and the computational power of a 1024-node IBM BlueGene cluster with distributed memory. © 2007 IEEE. |
Persistent Identifier | http://hdl.handle.net/10722/182996 |
References |
DC Field | Value | Language |
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dc.contributor.author | Hesford, AJ | en_US |
dc.contributor.author | Morsey, JD | en_US |
dc.contributor.author | Chew, WC | en_US |
dc.contributor.author | Deutsch, A | en_US |
dc.contributor.author | Smith, HH | en_US |
dc.date.accessioned | 2013-05-02T05:18:02Z | - |
dc.date.available | 2013-05-02T05:18:02Z | - |
dc.date.issued | 2007 | en_US |
dc.identifier.citation | Ieee Topical Meeting On Electrical Performance Of Electronic Packaging, 2007, p. 337-342 | en_US |
dc.identifier.uri | http://hdl.handle.net/10722/182996 | - |
dc.description.abstract | A parallel LU decomposition algorithm is presented to take advantage of the sparse impedance matrix produced by the reduced-coupling method. This algorithm allows rapid simulation of very large chip and packaging problems. A representative example is shown for a wide, on-chip data-bus that required one million surface unknowns and the computational power of a 1024-node IBM BlueGene cluster with distributed memory. © 2007 IEEE. | en_US |
dc.language | eng | en_US |
dc.relation.ispartof | IEEE Topical Meeting on Electrical Performance of Electronic Packaging | en_US |
dc.title | Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis | en_US |
dc.type | Conference_Paper | en_US |
dc.identifier.email | Chew, WC: wcchew@hku.hk | en_US |
dc.identifier.authority | Chew, WC=rp00656 | en_US |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.doi | 10.1109/EPEP.2007.4387196 | en_US |
dc.identifier.scopus | eid_2-s2.0-47949123260 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-47949123260&selection=ref&src=s&origin=recordpage | en_US |
dc.identifier.spage | 337 | en_US |
dc.identifier.epage | 342 | en_US |
dc.identifier.scopusauthorid | Hesford, AJ=15065327600 | en_US |
dc.identifier.scopusauthorid | Morsey, JD=6603025809 | en_US |
dc.identifier.scopusauthorid | Chew, WC=36014436300 | en_US |
dc.identifier.scopusauthorid | Deutsch, A=7102025083 | en_US |
dc.identifier.scopusauthorid | Smith, HH=7406226774 | en_US |