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- Publisher Website: 10.1109/ITHERM.2012.6231571
- Scopus: eid_2-s2.0-84866172348
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Conference Paper: Optimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systems
Title | Optimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systems |
---|---|
Authors | |
Keywords | Corona Discharge Cpu Fan Electrohydrodynamics Emerging Technology Forced Convection Air Cooling Heat Transfer Optimized Design Semiconductor Thermal Management |
Issue Date | 2012 |
Citation | Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems, Itherm, 2012, p. 1306-1311 How to Cite? |
Abstract | This work presents a microfabricated ionic wind pump array that has the potential to meet industry requirements as a next generation solution for thermal management of electronic systems. The optimized single device provides an improved COP of 26.5. The main purpose of the work presented here is to demonstrate that the optimized microfabricated ionic wind pump employed in an array provides superior cooling performance as compared to conventional CPU fans. © 2012 IEEE. |
Persistent Identifier | http://hdl.handle.net/10722/176496 |
ISSN | 2020 SCImago Journal Rankings: 0.201 |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ong, AO | en_US |
dc.contributor.author | Abramson, AR | en_US |
dc.contributor.author | Tien, NC | en_US |
dc.date.accessioned | 2012-11-26T09:50:22Z | - |
dc.date.available | 2012-11-26T09:50:22Z | - |
dc.date.issued | 2012 | en_US |
dc.identifier.citation | Intersociety Conference On Thermal And Thermomechanical Phenomena In Electronic Systems, Itherm, 2012, p. 1306-1311 | en_US |
dc.identifier.issn | 1936-3958 | en_US |
dc.identifier.uri | http://hdl.handle.net/10722/176496 | - |
dc.description.abstract | This work presents a microfabricated ionic wind pump array that has the potential to meet industry requirements as a next generation solution for thermal management of electronic systems. The optimized single device provides an improved COP of 26.5. The main purpose of the work presented here is to demonstrate that the optimized microfabricated ionic wind pump employed in an array provides superior cooling performance as compared to conventional CPU fans. © 2012 IEEE. | en_US |
dc.language | eng | en_US |
dc.relation.ispartof | InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM | en_US |
dc.subject | Corona Discharge | en_US |
dc.subject | Cpu Fan | en_US |
dc.subject | Electrohydrodynamics | en_US |
dc.subject | Emerging Technology | en_US |
dc.subject | Forced Convection Air Cooling | en_US |
dc.subject | Heat Transfer | en_US |
dc.subject | Optimized Design | en_US |
dc.subject | Semiconductor | en_US |
dc.subject | Thermal Management | en_US |
dc.title | Optimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systems | en_US |
dc.type | Conference_Paper | en_US |
dc.identifier.email | Tien, NC: nctien@hku.hk | en_US |
dc.identifier.authority | Tien, NC=rp01604 | en_US |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.doi | 10.1109/ITHERM.2012.6231571 | en_US |
dc.identifier.scopus | eid_2-s2.0-84866172348 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-84866172348&selection=ref&src=s&origin=recordpage | en_US |
dc.identifier.spage | 1306 | en_US |
dc.identifier.epage | 1311 | en_US |
dc.identifier.scopusauthorid | Ong, AO=55357279900 | en_US |
dc.identifier.scopusauthorid | Abramson, AR=55228392800 | en_US |
dc.identifier.scopusauthorid | Tien, NC=7006532826 | en_US |
dc.identifier.issnl | 1936-3958 | - |