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Conference Paper: Solder paste inspection by special led lighting for SMT manufacturing of printed circuit boards

TitleSolder paste inspection by special led lighting for SMT manufacturing of printed circuit boards
Authors
Chu, MHPang, GKH
KeywordsImage Processing
Solder Paste Inspection
Issue Date2007
Citation
Ifac Proceedings Volumes (Ifac-Papersonline), 2007, v. 8 PART 1, p. 222-226 How to Cite?
AbstractSolder paste screen printing is the first and very critical stage of manufacturing in an SMT production line of printed circuit boards (PCBs). Many defects can be eliminated with proper paste inspection. Conventional inspection method would depend on an image acquired from a camera mounted from the top. This 2D inspection of solder paste based on images is fast but is limited to defect such as bridge or no solder. Defects related to the volume of the printed solder paste or unevenness of the paste cannot be treated from a top image. The proposed method of this paper would involve the use of special directional LED lighting from the side. A sequence of four images is acquired and image processing is carried out for the edge information of the printed solder paste. The proposed method can handle other types of defects that cannot be treated by conventional top lighting images. © 2007 IFAC.
Persistent Identifierhttp://hdl.handle.net/10722/158714
ISSN
1474-6670
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorChu, MHen_US
dc.contributor.authorPang, GKHen_US
dc.date.accessioned2012-08-08T09:01:00Z-
dc.date.available2012-08-08T09:01:00Z-
dc.date.issued2007en_US
dc.identifier.citationIfac Proceedings Volumes (Ifac-Papersonline), 2007, v. 8 PART 1, p. 222-226en_US
dc.identifier.issn1474-6670en_US
dc.identifier.urihttp://hdl.handle.net/10722/158714-
dc.description.abstractSolder paste screen printing is the first and very critical stage of manufacturing in an SMT production line of printed circuit boards (PCBs). Many defects can be eliminated with proper paste inspection. Conventional inspection method would depend on an image acquired from a camera mounted from the top. This 2D inspection of solder paste based on images is fast but is limited to defect such as bridge or no solder. Defects related to the volume of the printed solder paste or unevenness of the paste cannot be treated from a top image. The proposed method of this paper would involve the use of special directional LED lighting from the side. A sequence of four images is acquired and image processing is carried out for the edge information of the printed solder paste. The proposed method can handle other types of defects that cannot be treated by conventional top lighting images. © 2007 IFAC.en_US
dc.languageengen_US
dc.relation.ispartofIFAC Proceedings Volumes (IFAC-PapersOnline)en_US
dc.subjectImage Processingen_US
dc.subjectSolder Paste Inspectionen_US
dc.titleSolder paste inspection by special led lighting for SMT manufacturing of printed circuit boardsen_US
dc.typeConference_Paperen_US
dc.identifier.emailPang, GKH:gpang@eee.hku.hken_US
dc.identifier.authorityPang, GKH=rp00162en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-79960966046en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-79960966046&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume8en_US
dc.identifier.issuePART 1en_US
dc.identifier.spage222en_US
dc.identifier.epage226en_US
dc.identifier.scopusauthoridChu, MH=47461010000en_US
dc.identifier.scopusauthoridPang, GKH=7103393283en_US
dc.identifier.issnl1474-6670-

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