Precision and performance of polysilicon micromirrors for hybrid integrated optics

Abstract

We have designed and built integrated, movable micromirrors for on-chip alignment in silicon-optical-bench technology. The mirrors are fabricated using surface micromachining with three polysilicon layers. A polysilicon-hinge technology was used to achieve the required vertical dimensions and functionality for alignment in hybrid photonic integrated circuits. The positioning accuracy of the mirrors is measured to be on the order of 0.2 μm. This precision is shown theoretically and experimentally to be sufficient for laser-to-fiber coupling. In the experimental verification, we used external actuators to position the micromirror and obtained 45% coupling efficiency from a semiconductor laser (operating at 1.3 μm) to a standard single-mode optical fiber. The stability and robustness of the micromirrors were demonstrated in shock and vibration tests that showed that the micromirrors will withstand normal handling and operation without the need for welding or gluing. This micromirror technology combines the low-cost advantage of passive alignment and the accuracy of active alignment. In addition to optoelectronic packaging, the micromirrors can be expected to find applications in grating-tuned external-cavity lasers, scanning lasers, and interferometers.