Showing results 1 to 2 of 2
Title | Author(s) | Issue Date | |
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Leakage mechanism in Cu damascene structure with methylsilane-doped low-k CVD oxide as intermetal dielectric Journal:IEEE Electron Device Letters | 2001 | ||
TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured α-SiC:H Dielectric Barrier Journal:Journal of the Electrochemical Society | 2004 |