Showing results 1 to 4 of 4
| Title | Author(s) | Issue Date | |
|---|---|---|---|
An Experimental Study on a Barrier-Less Cu Interconnect Scheme With Polyimide Insulator for Cost-Effective 3-D Packaging Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology | 13-May-2025 | ||
ESGReveal: An LLM-based approach for extracting structured data from ESG reports
Journal:Journal of Cleaner Production | 15-Jan-2025 | ||
| 2022 | |||
| 2000 |
