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Title | Author(s) | Issue Date | Views | |
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Effect of polyimide baking on bump resistance in flip-chip solder joints Journal:Microelectronics Reliability | 2014 | 126 |
Title | Author(s) | Issue Date | Views | |
---|---|---|---|---|
Effect of polyimide baking on bump resistance in flip-chip solder joints Journal:Microelectronics Reliability | 2014 | 126 |