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Browsing by Author Morsey, JD

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Showing results 1 to 6 of 6

	Title	Author(s)	Issue Date	Views
	Electromagnetic simulation for inhomogeneous interconnect and packaging structures Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging	Jiang, L Rubin, BJ Liu, Y Morsey, JD Deustch, A	2007	122
	Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer Proceeding/Conference:Proceedings - Electronic Components and Technology Conference	Morsey, JD Jiang, L Rubin, BJ Deutsch, A Surovic, CW Becker, D Haridass, A	2008	118
	Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP	Jiang, LJ Rubin, BJ Morsey, JD Hu, HT Elfadel, A	2006	122
	On the dual basis for solving electromagnetic surface integral equations Journal:IEEE Transactions on Antennas and Propagation	Tong, MS Chew, WC Rubin, BJ Morsey, JD Jiang, L	2009	182
	Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging	Hesford, AJ Morsey, JD Chew, WC Deutsch, A Smith, HH	2007
	The use of fast integral equations solvers for practical package and interconnect analysis Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP	Morsey, JD Rubin, BJ Jiang, L Shan, L Eisenberg, LB Becker, D Arseneault, M	2006	123

Showing results 1 to 6 of 6