Showing results 1 to 7 of 7
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Case Study: Cainiao and JD.com Leading Sustainability Packaging in China Proceeding/Conference:The 19th International Conference on Electronic Business (ICEB) Proceedings | 2019 | ||
A low-profile low-power converter with coreless PCB isolation transformer Journal:IEEE Transactions on Power Electronics | 2001 | ||
Packaging carbon nanotube based infrared detector Proceeding/Conference:2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007, Proceedings | 2007 | ||
Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging Journal:Journal of Materials Science: Materials in Electronics | 2010 | ||
RAID-x: A new distributed disk array for I/O-centric cluster computing Proceeding/Conference:Proceedings of the IEEE International Symposium on High Performance Distributed Computing | 2000 | ||
A systematic approach to manufacturing packaging logistics Journal:International Journal of Advanced Manufacturing Technology | 2006 | ||
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 |