Showing results 2 to 3 of 3
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Title | Author(s) | Issue Date | |
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Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films Journal:Electrochemical and Solid-State Letters | 2007 | ||
Mechanisms of silicon diffusion in erbium silicide Journal:Physical Review B - Condensed Matter and Materials Physics | 2007 |