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Article: Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films

TitleInterplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films
Authors
Yao, H. B.Bouville, M.Chi, D. Z.Sun, H. P.Pan, X. Q.Srolovitz, D. J.Mangelinck, D.
Issue Date2007
Citation
Electrochemical and Solid-State Letters, 2007, v. 10, n. 2 How to Cite?
DOI: http://dx.doi.org/10.1149/1.2400726
AbstractGermanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8 Ge0.2 (001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration. © 2006 The Electrochemical Society.
Persistent Identifierhttp://hdl.handle.net/10722/303292
ISSN
1099-0062
2014 Impact Factor: 2.321
ISI Accession Number ID
WOS:000243640400019

 

DC FieldValueLanguage
dc.contributor.authorYao, H. B.-
dc.contributor.authorBouville, M.-
dc.contributor.authorChi, D. Z.-
dc.contributor.authorSun, H. P.-
dc.contributor.authorPan, X. Q.-
dc.contributor.authorSrolovitz, D. J.-
dc.contributor.authorMangelinck, D.-
dc.date.accessioned2021-09-15T08:25:01Z-
dc.date.available2021-09-15T08:25:01Z-
dc.date.issued2007-
dc.identifier.citationElectrochemical and Solid-State Letters, 2007, v. 10, n. 2-
dc.identifier.issn1099-0062-
dc.identifier.urihttp://hdl.handle.net/10722/303292-
dc.description.abstractGermanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8 Ge0.2 (001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration. © 2006 The Electrochemical Society.-
dc.languageeng-
dc.relation.ispartofElectrochemical and Solid-State Letters-
dc.titleInterplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1149/1.2400726-
dc.identifier.scopuseid_2-s2.0-33845921497-
dc.identifier.volume10-
dc.identifier.issue2-
dc.identifier.isiWOS:000243640400019-

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