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    HKU ResearcherPage: Feng, SPT
     
    rp01533.jpg picture
    Dr Feng, Shien Ping Tony
    馮憲平
    Title
    • Assistant Professor
    Dept:
    Faculty:
    Publication list (Conference Papers)
    Results 1-8 of 8
    TypeTitleAuthor(s)YearViews
    Nickel Hydroxide Nanostructures for 2D Microchannels Applications
    Proceedings/Conference:
    International Symposium on Advanced Functional Materials (ISAFM 2014), Kuala Lumpur, Malaysia, Aug. 1-2, 2014.
    Feng, SPT20143
     
    Electroplating Ni-Au Low Ohmic Contacts on Nanostructured Bi2Te3 Alloys
    Proceedings/Conference:
    Minerals, Metals & Materials Society (TMS) Annual Meeting & Exhibition
    Publisher:
    The Minerals, Metals & Materials Society (TMS).
    Feng, SPT; Chang, YH20147
     
    Reliable contact fabrication by electroplating nickel/gold on nanostructured Bi2Te3-based alloys pretreated by self-assembled MPS monolayer
    Proceedings/Conference:
    THERMEC
    Feng, SPT20133
     
    Electrochemical Fabrication of Optical Transparent and Tunable Wettability Nickel Hydroxide for 2D Microfluidic Channels
    Proceedings/Conference:
    EITA Young Investigator Conference
    Publisher:
    The Emerging Information and Technology Association (EITA).
    Feng, SPT20137
     
    Thermoelectric energy conversion using nanostructured materials
    Proceedings/Conference:
    Proceedings of SPIE - The International Society for Optical Engineering
    Publisher:
    S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
    Chen, G; Kraemer, D; Muto, A; McEnaney, K; Feng, HP; Liu, WS; Zhang, Q; Yu, B; Ren, Z2011322
     
    Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing
    Proceedings/Conference:
    Thin Solid Films
    Publisher:
    Elsevier S.A.. The Journal's web site is located at http://www.elsevier.com/locate/tsf
    Cheng, MY; Chen, KW; Liu, TF; Wang, YL; Feng, HP2010318
     
    Mechanism for Cu void defect on various electroplated film conditions
    Proceedings/Conference:
    Thin Solid Films
    Publisher:
    Elsevier S.A.. The Journal's web site is located at http://www.elsevier.com/locate/tsf
    Feng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC2006402
     
    Investigation of the behaviors of various electroplated copper films during CMP
    Proceedings/Conference:
    2006 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2006 Technical Proceedings
    Feng, HP; Cheng, MY; Wang, YY; Wan, CC2006198
     

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