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    HKU ResearcherPage: Feng, SPT
    rp01533.jpg picture
    Dr Feng, Shien Ping Tony
    • Assistant Professor
    Publication list (Conference Papers)
    Results 1-8 of 8
    Electroplating Ni-Au Low Ohmic Contacts on Nanostructured Bi2Te3 Alloys
    Minerals, Metals & Materials Society (TMS) Annual Meeting & Exhibition
    The Minerals, Metals & Materials Society (TMS).
    Feng, SPT; Chang, YH201429
    Nickel Hydroxide Nanostructures for 2D Microchannels Applications
    International Symposium on Advanced Functional Materials (ISAFM)
    Feng, SPT201428
    Electrochemical Fabrication of Optical Transparent and Tunable Wettability Nickel Hydroxide for 2D Microfluidic Channels
    EITA Young Investigator Conference
    The Emerging Information and Technology Association (EITA).
    Feng, SPT201334
    Reliable contact fabrication by electroplating nickel/gold on nanostructured Bi2Te3-based alloys pretreated by self-assembled MPS monolayer
    International Conference on Processing & Manufacturing of Advanced Materials (THERMEC)
    Feng, SPT201324
    Thermoelectric energy conversion using nanostructured materials
    Proceedings of SPIE - The International Society for Optical Engineering
    S P I E - International Society for Optical Engineering. The Journal's web site is located at http://spie.org/x1848.xml
    Chen, G; Kraemer, D; Muto, A; McEnaney, K; Feng, HP; Liu, WS; Zhang, Q; Yu, B; Ren, Z2011371
    Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing
    Thin Solid Films
    Elsevier S.A.. The Journal's web site is located at http://www.elsevier.com/locate/tsf
    Cheng, MY; Chen, KW; Liu, TF; Wang, YL; Feng, HP2010379
    Investigation of the behaviors of various electroplated copper films during CMP
    2006 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2006 Technical Proceedings
    Feng, HP; Cheng, MY; Wang, YY; Wan, CC2006240
    Mechanism for Cu void defect on various electroplated film conditions
    Thin Solid Films
    Elsevier S.A.. The Journal's web site is located at http://www.elsevier.com/locate/tsf
    Feng, HP; Cheng, MY; Wang, YL; Chang, SC; Wang, YY; Wan, CC2006458



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