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Conference Paper: Reliable contact fabrication by electroplating nickel/gold on nanostructured Bi2Te3-based alloys pretreated by self-assembled MPS monolayer

TitleReliable contact fabrication by electroplating nickel/gold on nanostructured Bi2Te3-based alloys pretreated by self-assembled MPS monolayer
Authors
Feng, SPT
Issue Date2013
Citation
The 8th International Conference on Processing & Manufacturing of Advanced Materials (THERMEC 2013), Las Vegas, USA, 2-6 December 2013 How to Cite?
DescriptionSession L2: Nanomaterials for Structural & Energy Application II
Persistent Identifierhttp://hdl.handle.net/10722/201258

 

DC FieldValueLanguage
dc.contributor.authorFeng, SPTen_US
dc.date.accessioned2014-08-21T07:19:44Z-
dc.date.available2014-08-21T07:19:44Z-
dc.date.issued2013en_US
dc.identifier.citationThe 8th International Conference on Processing & Manufacturing of Advanced Materials (THERMEC 2013), Las Vegas, USA, 2-6 December 2013en_US
dc.identifier.urihttp://hdl.handle.net/10722/201258-
dc.descriptionSession L2: Nanomaterials for Structural & Energy Application II-
dc.languageengen_US
dc.relation.ispartofInternational Conference on Processing & Manufacturing of Advanced Materials (THERMEC)en_US
dc.titleReliable contact fabrication by electroplating nickel/gold on nanostructured Bi2Te3-based alloys pretreated by self-assembled MPS monolayeren_US
dc.typeConference_Paperen_US
dc.identifier.emailFeng, SPT: hpfeng@hku.hken_US
dc.identifier.authorityFeng, SPT=rp01533en_US
dc.identifier.hkuros234436en_US

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