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Showing results 5 to 11 of 11
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Title
Author(s)
Issue Date
Interconnect performance and scaling strategy for the 22 nm node and beyond
Proceeding/Conference:
Advanced Metallization Conference (AMC)
Chen, JHC
Jiang, L
Deutsch, A
Angyal, MS
Spooner, TA
2009
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
Proceeding/Conference:
Proceedings - Electronic Components and Technology Conference
Morsey, JD
Jiang, L
Rubin, BJ
Deutsch, A
Surovic, CW
Becker, D
Haridass, A
2008
Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis
Proceeding/Conference:
IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Hesford, AJ
Morsey, JD
Chew, WC
Deutsch, A
Smith, HH
2007
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Proceeding/Conference:
Electrical Performance of Electronic Packaging, EPEP
Jiang, L
Kolluri, S
Rubin, BJ
Smith, H
Colgan, EG
Scheuermann, MR
Wakit, JA
Deutsch, A
Gill, J
2008
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
Journal:
IEEE Transactions on Advanced Packaging
Jiang, L
Xu, C
Rubin, BJ
Weger, AJ
Deutsch, A
Smith, H
Caron, A
Banerjee, K
2010
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
Proceeding/Conference:
IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Morsey, J
Deutsch, A
Libous, JP
Surovic, C
Rubin, BJ
Jiang, L
Eisenberg, L
2005
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
Proceeding/Conference:
IEEE Transactions on Advanced Packaging
Morsey, J
Deutsch, A
Libous, JP
Surovic, C
Rubin, BJ
Jiang, L
Eisenberg, L
2007