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Article: Effects of water plasma immersion ion implantation on surface electrochemical behavior of NiTi shape memory alloys in simulated body fluids

TitleEffects of water plasma immersion ion implantation on surface electrochemical behavior of NiTi shape memory alloys in simulated body fluids
Authors
KeywordsElectrochemical impedance spectroscopy
NiTi
Plasma immersion ion implantation
Water plasma immersion ion implantation
Issue Date2007
PublisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/apsusc
Citation
Applied Surface Science, 2007, v. 253 n. 6, p. 3154-3159 How to Cite?
AbstractWater plasma immersion ion implantation (PIII) was conducted on orthopedic NiTi shape memory alloy to enhance the surface electrochemical characteristics. The surface composition of the NiTi alloy before and after H2O-PIII was determined by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) was utilized to determine the roughness and morphology of the NiTi samples. Potentiodynamic polarization tests and electrochemical impedance spectroscopy (EIS) were carried out to investigate the surface electrochemical behavior of the control and H2O-PIII NiTi samples in simulated body fluids (SBF) at 37 °C as well as the mechanism. The H2O-PIII NiTi sample showed a higher breakdown potential (Eb) than the control sample. Based on the AFM results, two different physical models with related equivalent electrical circuits were obtained to fit the EIS data and explain the surface electrochemical behavior of NiTi in SBF. The simulation results demonstrate that the higher resistance of the oxide layer produced by H2O-PIII is primarily responsible for the improvement in the surface corrosion resistance. © 2006 Elsevier B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/79626
ISSN
2023 Impact Factor: 6.3
2023 SCImago Journal Rankings: 1.210
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorLiu, XMen_HK
dc.contributor.authorWu, SLen_HK
dc.contributor.authorChu, PKen_HK
dc.contributor.authorChung, CYen_HK
dc.contributor.authorChu, CLen_HK
dc.contributor.authorYeung, KWKen_HK
dc.contributor.authorLu, WWen_HK
dc.contributor.authorCheung, KMCen_HK
dc.contributor.authorLuk, KDKen_HK
dc.date.accessioned2010-09-06T07:56:46Z-
dc.date.available2010-09-06T07:56:46Z-
dc.date.issued2007en_HK
dc.identifier.citationApplied Surface Science, 2007, v. 253 n. 6, p. 3154-3159en_HK
dc.identifier.issn0169-4332en_HK
dc.identifier.urihttp://hdl.handle.net/10722/79626-
dc.description.abstractWater plasma immersion ion implantation (PIII) was conducted on orthopedic NiTi shape memory alloy to enhance the surface electrochemical characteristics. The surface composition of the NiTi alloy before and after H2O-PIII was determined by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) was utilized to determine the roughness and morphology of the NiTi samples. Potentiodynamic polarization tests and electrochemical impedance spectroscopy (EIS) were carried out to investigate the surface electrochemical behavior of the control and H2O-PIII NiTi samples in simulated body fluids (SBF) at 37 °C as well as the mechanism. The H2O-PIII NiTi sample showed a higher breakdown potential (Eb) than the control sample. Based on the AFM results, two different physical models with related equivalent electrical circuits were obtained to fit the EIS data and explain the surface electrochemical behavior of NiTi in SBF. The simulation results demonstrate that the higher resistance of the oxide layer produced by H2O-PIII is primarily responsible for the improvement in the surface corrosion resistance. © 2006 Elsevier B.V. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/apsuscen_HK
dc.relation.ispartofApplied Surface Scienceen_HK
dc.rightsApplied Surface Science. Copyright © Elsevier BV.en_HK
dc.subjectElectrochemical impedance spectroscopyen_HK
dc.subjectNiTien_HK
dc.subjectPlasma immersion ion implantationen_HK
dc.subjectWater plasma immersion ion implantationen_HK
dc.titleEffects of water plasma immersion ion implantation on surface electrochemical behavior of NiTi shape memory alloys in simulated body fluidsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0169-4332&volume=253&issue=6&spage=3154&epage=9&date=2007&atitle=Effects+of+water+plasma+immersion+ion+implantation+on+surface+electrochemical+behavior+of+NiTi+shape+memory+alloys+in+simulated+body+fluidsen_HK
dc.identifier.emailYeung, KWK:wkkyeung@hkucc.hku.hken_HK
dc.identifier.emailLu, WW:wwlu@hku.hken_HK
dc.identifier.emailCheung, KMC:cheungmc@hku.hken_HK
dc.identifier.emailLuk, KDK:hcm21000@hku.hken_HK
dc.identifier.authorityYeung, KWK=rp00309en_HK
dc.identifier.authorityLu, WW=rp00411en_HK
dc.identifier.authorityCheung, KMC=rp00387en_HK
dc.identifier.authorityLuk, KDK=rp00333en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.apsusc.2006.07.008en_HK
dc.identifier.scopuseid_2-s2.0-33845768891en_HK
dc.identifier.hkuros137235en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33845768891&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume253en_HK
dc.identifier.issue6en_HK
dc.identifier.spage3154en_HK
dc.identifier.epage3159en_HK
dc.identifier.isiWOS:000243830000025-
dc.publisher.placeNetherlandsen_HK
dc.identifier.scopusauthoridLiu, XM=8408205200en_HK
dc.identifier.scopusauthoridWu, SL=15125218800en_HK
dc.identifier.scopusauthoridChu, PK=36040705700en_HK
dc.identifier.scopusauthoridChung, CY=8100842800en_HK
dc.identifier.scopusauthoridChu, CL=7404345713en_HK
dc.identifier.scopusauthoridYeung, KWK=13309584700en_HK
dc.identifier.scopusauthoridLu, WW=7404215221en_HK
dc.identifier.scopusauthoridCheung, KMC=7402406754en_HK
dc.identifier.scopusauthoridLuk, KDK=7201921573en_HK
dc.identifier.issnl0169-4332-

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