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Article: A multi-material virtual prototyping system for product development and biomedical engineering

TitleA multi-material virtual prototyping system for product development and biomedical engineering
Authors
KeywordsMulti-material layered manufacturing
Sequential and concurrent multi-toolpath planning
Virtual prototyping
Virtual reality simulation
Issue Date2005
PublisherTaylor & Francis, co-published with CAD Solutions. The Journal's web site is located at http://www.cadanda.com
Citation
Computer-Aided Design and Applications, 2005, v. 2 n. 1-4, p. 329-338 How to Cite?
AbstractThis paper proposes a multi-material virtual prototyping (MMVP) system that integrates the virtual reality (VR) and the layered manufacturing (LM) technologies for digital fabrication of heterogeneous multi-material prototypes for advanced product development and biomedical engineering. The system consists mainly of two algorithms for sequential and concurrent multitoolpath planning, and a virtual prototyping system. The algorithms adopt a topological hierarchysorting algorithm to establish the hierarchy relationship of multi-material slice contours for facilitating toolpath planning of multi-material layered manufacturing (MMLM). Subsequently, the sequential multi-toolpath planning algorithm generates sequential toolpaths that avoid redundant tool movements. To reduce build time further, the concurrent multi-toolpath planning algorithm generates collision-free concurrent toolpaths. Based on the hierarchy information, a bounding box can be adopted to approximate envelopes of contour families of the same material property to simplify detection of tool collisions. The algorithms are integrated to form the MMVP system for planning, stereoscopic simulation, and validation of multi-toolpaths for MMLM.
Persistent Identifierhttp://hdl.handle.net/10722/74258
ISSN
2020 SCImago Journal Rankings: 0.327
References

 

DC FieldValueLanguage
dc.contributor.authorChoi, SHen_HK
dc.contributor.authorCheung, HHen_HK
dc.date.accessioned2010-09-06T06:59:31Z-
dc.date.available2010-09-06T06:59:31Z-
dc.date.issued2005en_HK
dc.identifier.citationComputer-Aided Design and Applications, 2005, v. 2 n. 1-4, p. 329-338en_HK
dc.identifier.issn1686-4360en_HK
dc.identifier.urihttp://hdl.handle.net/10722/74258-
dc.description.abstractThis paper proposes a multi-material virtual prototyping (MMVP) system that integrates the virtual reality (VR) and the layered manufacturing (LM) technologies for digital fabrication of heterogeneous multi-material prototypes for advanced product development and biomedical engineering. The system consists mainly of two algorithms for sequential and concurrent multitoolpath planning, and a virtual prototyping system. The algorithms adopt a topological hierarchysorting algorithm to establish the hierarchy relationship of multi-material slice contours for facilitating toolpath planning of multi-material layered manufacturing (MMLM). Subsequently, the sequential multi-toolpath planning algorithm generates sequential toolpaths that avoid redundant tool movements. To reduce build time further, the concurrent multi-toolpath planning algorithm generates collision-free concurrent toolpaths. Based on the hierarchy information, a bounding box can be adopted to approximate envelopes of contour families of the same material property to simplify detection of tool collisions. The algorithms are integrated to form the MMVP system for planning, stereoscopic simulation, and validation of multi-toolpaths for MMLM.en_HK
dc.languageengen_HK
dc.publisherTaylor & Francis, co-published with CAD Solutions. The Journal's web site is located at http://www.cadanda.comen_HK
dc.relation.ispartofComputer-Aided Design and Applicationsen_HK
dc.subjectMulti-material layered manufacturingen_HK
dc.subjectSequential and concurrent multi-toolpath planningen_HK
dc.subjectVirtual prototypingen_HK
dc.subjectVirtual reality simulationen_HK
dc.titleA multi-material virtual prototyping system for product development and biomedical engineeringen_HK
dc.typeArticleen_HK
dc.identifier.emailChoi, SH:shchoi@hkucc.hku.hken_HK
dc.identifier.authorityChoi, SH=rp00109en_HK
dc.description.naturelink_to_OA_fulltext-
dc.identifier.doi10.1080/16864360.2005.10738381-
dc.identifier.scopuseid_2-s2.0-41649109729en_HK
dc.identifier.hkuros99421en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-41649109729&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume2en_HK
dc.identifier.issue1-4en_HK
dc.identifier.spage329en_HK
dc.identifier.epage338en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridChoi, SH=7408119615en_HK
dc.identifier.scopusauthoridCheung, HH=26031961100en_HK
dc.identifier.issnl1686-4360-

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