File Download
  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Fracture analysis of bounded magnetoelectroelastic layers with interfacial cracks under magnetoelectromechanical loads: Plane problem

TitleFracture analysis of bounded magnetoelectroelastic layers with interfacial cracks under magnetoelectromechanical loads: Plane problem
Authors
KeywordsEnergy release rate
Magnetoelectroelastic layer
Mode-I problem
Multiple interfacial cracks
Singular integral equation
Issue Date2010
PublisherSage Publications Ltd.. The Journal's web site is located at http://jim.sagepub.com
Citation
Journal Of Intelligent Material Systems And Structures, 2010, v. 21 n. 6, p. 581-594 How to Cite?
AbstractFracture behaviors of multiple interfacial cracks between dissimilar magnetoelectroelastic layers subjected to in-plane magnetoelectromechanical loads are investigated by using integral transform method and singular integral equation technique. The number of the interfacial cracks is arbitrary, and the crack surfaces are assumed to be magnetoelectrically impermeable. The field intensity factors including stress, electric displacement and magnetic induction intensity factors as well as the energy release rates (ERRs) are derived. The effects of loading combinations, crack configurations and material property parameters on the fracture behaviors are evaluated according to energy release rate criterion. Numerical results show that both negative electrical and magnetic loads inhibit crack extension, and that the material constants have different and important effects on the ERRs. The results presented here should have potential applications to the design of multilayered magnetoelectroelastic structures. © The Author(s), 2010.
Persistent Identifierhttp://hdl.handle.net/10722/71815
ISSN
2023 Impact Factor: 2.4
2023 SCImago Journal Rankings: 0.598
ISI Accession Number ID
Funding AgencyGrant Number
Natural Science Fund of China10772123
Natural Science Fund for Outstanding Younger of Hebei Province, ChinaA2009001624
Funding Information:

The work was supported by Natural Science Fund of China (10772123) and Natural Science Fund for Outstanding Younger of Hebei Province (A2009001624), China.

References

 

DC FieldValueLanguage
dc.contributor.authorFeng, WJen_HK
dc.contributor.authorSu, RKLen_HK
dc.contributor.authorLiu, JXen_HK
dc.contributor.authorLi, YSen_HK
dc.date.accessioned2010-09-06T06:35:25Z-
dc.date.available2010-09-06T06:35:25Z-
dc.date.issued2010en_HK
dc.identifier.citationJournal Of Intelligent Material Systems And Structures, 2010, v. 21 n. 6, p. 581-594en_HK
dc.identifier.issn1045-389Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/71815-
dc.description.abstractFracture behaviors of multiple interfacial cracks between dissimilar magnetoelectroelastic layers subjected to in-plane magnetoelectromechanical loads are investigated by using integral transform method and singular integral equation technique. The number of the interfacial cracks is arbitrary, and the crack surfaces are assumed to be magnetoelectrically impermeable. The field intensity factors including stress, electric displacement and magnetic induction intensity factors as well as the energy release rates (ERRs) are derived. The effects of loading combinations, crack configurations and material property parameters on the fracture behaviors are evaluated according to energy release rate criterion. Numerical results show that both negative electrical and magnetic loads inhibit crack extension, and that the material constants have different and important effects on the ERRs. The results presented here should have potential applications to the design of multilayered magnetoelectroelastic structures. © The Author(s), 2010.en_HK
dc.languageengen_HK
dc.publisherSage Publications Ltd.. The Journal's web site is located at http://jim.sagepub.comen_HK
dc.relation.ispartofJournal of Intelligent Material Systems and Structuresen_HK
dc.rightsJournal of Intelligent Material Systems and Structures. Copyright © Sage Publications Ltd..-
dc.subjectEnergy release rateen_HK
dc.subjectMagnetoelectroelastic layeren_HK
dc.subjectMode-I problemen_HK
dc.subjectMultiple interfacial cracksen_HK
dc.subjectSingular integral equationen_HK
dc.titleFracture analysis of bounded magnetoelectroelastic layers with interfacial cracks under magnetoelectromechanical loads: Plane problemen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1045-389X&volume=21&issue=6&spage=581&epage=594&date=2010&atitle=Fracture+analysis+of+bounded+magnetoelectroelastic+layers+with+interfacial+cracks+under+magnetoelectromechanical+loads:+plane+problemen_HK
dc.identifier.emailSu, RKL:klsu@hkucc.hku.hken_HK
dc.identifier.authoritySu, RKL=rp00072en_HK
dc.description.naturepostprint-
dc.identifier.doi10.1177/1045389X10361630en_HK
dc.identifier.scopuseid_2-s2.0-77953165373en_HK
dc.identifier.hkuros169570en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-77953165373&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume21en_HK
dc.identifier.issue6en_HK
dc.identifier.spage581en_HK
dc.identifier.epage594en_HK
dc.identifier.isiWOS:000275907200002-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridFeng, WJ=12752270200en_HK
dc.identifier.scopusauthoridSu, RKL=7102627096en_HK
dc.identifier.scopusauthoridLiu, JX=36063914500en_HK
dc.identifier.scopusauthoridLi, YS=7502080583en_HK
dc.identifier.issnl1045-389X-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats