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Article: Numerical modelling of soil nails in loose fill slope under surcharge loading

TitleNumerical modelling of soil nails in loose fill slope under surcharge loading
Authors
KeywordsField test
Finite element modelling
Loose fill slope
Soil nail
Issue Date2009
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/compgeo
Citation
Computers And Geotechnics, 2009, v. 36 n. 5, p. 837-850 How to Cite?
AbstractA plane-strain numerical model has been developed to mimic a nailed loose fill slope under surcharge loading. The model has been used to back-analyse a field test that was conducted to examine the behaviour of soil nails in loose fill slopes under surcharge loading. Incremental elasto-plastic analyses coupled with pore water diffusion have been performed to study the internal deformation, water content redistribution in the soil, and the performance of the soil nails during and after the application of surcharge loading. The model parameters describing the mechanical and hydraulic properties of the nailed slope were obtained from field or laboratory tests. Different modelling techniques and boundary conditions for mimicking soil-nail interaction in loose fill material have been examined. Comparisons between numerical predictions and field measurements demonstrate that a new interfacial model, denoted as the embedded bond-slip interface model, is more suitable for mimicking the interfacial behaviour. Despite the simplicity of the numerical model, the predicted responses are in close agreement with the field test results, in particular the mobilisation and distribution of nail forces in response to surcharge loading. Both the numerical and the field test results suggest that soil nails are capable of increasing the overall stability of a loose fill slope for the loading conditions considered in this study. The increase in confining stress along the soil nails near the surcharge area is central to the overall stabilising mechanism. On the contrary, the nail forces mobilised near the nail heads are much smaller, indicating that the beneficial effect of having a structural grillage system at the slope face is limited for the range of surcharge pressures considered in this study. © 2009 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/58512
ISSN
2023 Impact Factor: 5.3
2023 SCImago Journal Rankings: 1.725
ISI Accession Number ID
Funding AgencyGrant Number
University of Hong Kong7176/05E
7171/06E
Funding Information:

The authors acknowledge the support by Grant Nos. 7176/05E and 7171/06E of the University of Hong Kong.

References

 

DC FieldValueLanguage
dc.contributor.authorZhou, YDen_HK
dc.contributor.authorCheuk, CYen_HK
dc.contributor.authorTham, LGen_HK
dc.date.accessioned2010-05-31T03:31:44Z-
dc.date.available2010-05-31T03:31:44Z-
dc.date.issued2009en_HK
dc.identifier.citationComputers And Geotechnics, 2009, v. 36 n. 5, p. 837-850en_HK
dc.identifier.issn0266-352Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/58512-
dc.description.abstractA plane-strain numerical model has been developed to mimic a nailed loose fill slope under surcharge loading. The model has been used to back-analyse a field test that was conducted to examine the behaviour of soil nails in loose fill slopes under surcharge loading. Incremental elasto-plastic analyses coupled with pore water diffusion have been performed to study the internal deformation, water content redistribution in the soil, and the performance of the soil nails during and after the application of surcharge loading. The model parameters describing the mechanical and hydraulic properties of the nailed slope were obtained from field or laboratory tests. Different modelling techniques and boundary conditions for mimicking soil-nail interaction in loose fill material have been examined. Comparisons between numerical predictions and field measurements demonstrate that a new interfacial model, denoted as the embedded bond-slip interface model, is more suitable for mimicking the interfacial behaviour. Despite the simplicity of the numerical model, the predicted responses are in close agreement with the field test results, in particular the mobilisation and distribution of nail forces in response to surcharge loading. Both the numerical and the field test results suggest that soil nails are capable of increasing the overall stability of a loose fill slope for the loading conditions considered in this study. The increase in confining stress along the soil nails near the surcharge area is central to the overall stabilising mechanism. On the contrary, the nail forces mobilised near the nail heads are much smaller, indicating that the beneficial effect of having a structural grillage system at the slope face is limited for the range of surcharge pressures considered in this study. © 2009 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/compgeoen_HK
dc.relation.ispartofComputers and Geotechnicsen_HK
dc.subjectField testen_HK
dc.subjectFinite element modellingen_HK
dc.subjectLoose fill slopeen_HK
dc.subjectSoil nailen_HK
dc.titleNumerical modelling of soil nails in loose fill slope under surcharge loadingen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0266-352X&volume=36&spage=837&epage=850&date=2009&atitle=Numerical+modelling+of+soil+nails+in+loose+fill+slope+under+surcharge+loadingen_HK
dc.identifier.emailZhou, YD: zhouyuande@gmail.comen_HK
dc.identifier.emailTham, LG: hrectlg@hku.hken_HK
dc.identifier.authorityZhou, YD=rp00215en_HK
dc.identifier.authorityTham, LG=rp00176en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.compgeo.2009.01.010en_HK
dc.identifier.scopuseid_2-s2.0-64849083667en_HK
dc.identifier.hkuros162451en_HK
dc.identifier.hkuros212156-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-64849083667&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume36en_HK
dc.identifier.issue5en_HK
dc.identifier.spage837en_HK
dc.identifier.epage850en_HK
dc.identifier.isiWOS:000266227200015-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridZhou, YD=7405363896en_HK
dc.identifier.scopusauthoridCheuk, CY=16240702800en_HK
dc.identifier.scopusauthoridTham, LG=7006213628en_HK
dc.identifier.citeulike5236216-
dc.identifier.issnl0266-352X-

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