Showing results 1 to 5 of 5
Title | Author(s) | Issue Date | |
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Disconnection-mediated migration of interfaces in microstructures: I. continuum model Journal:Acta Materialia | 2022 | ||
2022 | |||
Disconnection-mediated twin junction migration mechanism in FCC metals Journal:Microscopy and Microanalysis | 2021 | ||
Modelling of dislocations, twins and crack-tips in HCP and BCC Ti Journal:International Journal of Plasticity | 1-Jul-2023 | ||
Tracking the sliding of grain boundaries at the atomic scale Journal:Science | 2022 |