Showing results 1 to 2 of 2
Title | Author(s) | Issue Date | Views | |
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Atomistic simulations of stress and microstructure evolution during polycrystalline Ni film growth Journal:Physical Review B - Condensed Matter and Materials Physics | 2009 | 3 | ||
Thin film compressive stresses due to adatom insertion into grain boundaries Journal:Physical Review Letters | 2007 |