Showing results 1 to 5 of 5
Title | Author(s) | Issue Date | |
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A Nonlinear Study of EEG in Patients with Affective Disorder Proceeding/Conference:Brain and Cognition | 2003 | ||
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration Proceeding/Conference:2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010 | 2010 | ||
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD | 2009 | ||
Mixed Precision Quantization for ReRAM-based DNN Inference Accelerators Proceeding/Conference:Asia and South Pacific Design Automation Conference Proceedings | 2021 | ||
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 |