Showing results 1 to 4 of 4
Title | Author(s) | Issue Date | |
---|---|---|---|
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration Proceeding/Conference:2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010 | 2010 | ||
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD | 2009 | ||
Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2008 | ||
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 |