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	Title	Author(s)	Issue Date	Views
	3-D measurement of solder paste using two-step phase shift profilometry Journal:IEEE Transactions on Electronics Packaging Manufacturing	Hui, TW Pang, GKH	2008
	3D profile reconstruction of solder paste based on phase shift profilometry Proceeding/Conference:IEEE International Conference on Industrial Informatics (INDIN)	Hui, TW Pang, GKH	2007	113
	Erratum: Solder paste inspection using region-based defect detection (International Journal of Advanced Manufacturing Technology DOI 10.1007/s00170-008-1639-6) Journal:International Journal of Advanced Manufacturing Technology	Hui, TW Pang, GKH	2009
	Solder paste inspection using region-based defect detection Journal:International Journal of Advanced Manufacturing Technology	Hui, TW Pang, GKH	2009	210

Showing results 1 to 4 of 4