Showing results 1 to 3 of 3
| Title | Author(s) | Issue Date | |
|---|---|---|---|
| 1997 | |||
Optimization of bit-pairing codification with learning for 3D reconstruction Journal:International Journal of Image and Graphics | 2007 | ||
Use of paraplanar constraint for parallel inspection of wafer bump heights Proceeding/Conference:International Conference on Image Processing, Computer Vision, and Pattern Recognition, IPCV 2007 | 2007 |