Showing results 1 to 2 of 2
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer Proceeding/Conference:Proceedings - Electronic Components and Technology Conference | 2008 | ||
The use of fast integral equations solvers for practical package and interconnect analysis Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2006 |