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- Publisher Website: 10.1016/j.actamat.2025.120938
- Scopus: eid_2-s2.0-105000541332
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Article: Kirkendall void inhibition through the elimination of diffusivity mismatch assisted by nanocrystalline metal
| Title | Kirkendall void inhibition through the elimination of diffusivity mismatch assisted by nanocrystalline metal |
|---|---|
| Authors | |
| Keywords | 3D IC Interconnects Kirkendall effect Nanocrystalline metal Thin film diffusion |
| Issue Date | 1-May-2025 |
| Publisher | Elsevier |
| Citation | Acta Materialia, 2025, v. 289 How to Cite? |
| Abstract | In this article, a general method for Kirkendall effect suppression has been proposed that harnesses the diffusivity enhancement effect brought by nanocrystalline metals. Through increasing the fraction of grain boundaries in the fast-diffusing species in the unbalanced diffusion couple, the flux of the slow diffusor can be enhanced through short-circuit diffusion, thus reducing the diffusivity gap, which is the root cause of the Kirkendall effect. Experiments have been performed on both Au-Cu and Au-Ag systems with successful results. A model has been established based on the Au-Cu system that predicts the diffusivity enhancement effect concerning the initial nanocrystalline Cu grain size. |
| Persistent Identifier | http://hdl.handle.net/10722/360779 |
| ISSN | 2023 Impact Factor: 8.3 2023 SCImago Journal Rankings: 2.916 |
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Wang, Y. | - |
| dc.contributor.author | Bian, Y. R. | - |
| dc.contributor.author | Huang, M. X. | - |
| dc.date.accessioned | 2025-09-13T00:36:20Z | - |
| dc.date.available | 2025-09-13T00:36:20Z | - |
| dc.date.issued | 2025-05-01 | - |
| dc.identifier.citation | Acta Materialia, 2025, v. 289 | - |
| dc.identifier.issn | 1359-6454 | - |
| dc.identifier.uri | http://hdl.handle.net/10722/360779 | - |
| dc.description.abstract | In this article, a general method for Kirkendall effect suppression has been proposed that harnesses the diffusivity enhancement effect brought by nanocrystalline metals. Through increasing the fraction of grain boundaries in the fast-diffusing species in the unbalanced diffusion couple, the flux of the slow diffusor can be enhanced through short-circuit diffusion, thus reducing the diffusivity gap, which is the root cause of the Kirkendall effect. Experiments have been performed on both Au-Cu and Au-Ag systems with successful results. A model has been established based on the Au-Cu system that predicts the diffusivity enhancement effect concerning the initial nanocrystalline Cu grain size. | - |
| dc.language | eng | - |
| dc.publisher | Elsevier | - |
| dc.relation.ispartof | Acta Materialia | - |
| dc.subject | 3D IC | - |
| dc.subject | Interconnects | - |
| dc.subject | Kirkendall effect | - |
| dc.subject | Nanocrystalline metal | - |
| dc.subject | Thin film diffusion | - |
| dc.title | Kirkendall void inhibition through the elimination of diffusivity mismatch assisted by nanocrystalline metal | - |
| dc.type | Article | - |
| dc.identifier.doi | 10.1016/j.actamat.2025.120938 | - |
| dc.identifier.scopus | eid_2-s2.0-105000541332 | - |
| dc.identifier.volume | 289 | - |
| dc.identifier.eissn | 1873-2453 | - |
| dc.identifier.issnl | 1359-6454 | - |
