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Article: Kirkendall void inhibition through the elimination of diffusivity mismatch assisted by nanocrystalline metal

TitleKirkendall void inhibition through the elimination of diffusivity mismatch assisted by nanocrystalline metal
Authors
Keywords3D IC
Interconnects
Kirkendall effect
Nanocrystalline metal
Thin film diffusion
Issue Date1-May-2025
PublisherElsevier
Citation
Acta Materialia, 2025, v. 289 How to Cite?
AbstractIn this article, a general method for Kirkendall effect suppression has been proposed that harnesses the diffusivity enhancement effect brought by nanocrystalline metals. Through increasing the fraction of grain boundaries in the fast-diffusing species in the unbalanced diffusion couple, the flux of the slow diffusor can be enhanced through short-circuit diffusion, thus reducing the diffusivity gap, which is the root cause of the Kirkendall effect. Experiments have been performed on both Au-Cu and Au-Ag systems with successful results. A model has been established based on the Au-Cu system that predicts the diffusivity enhancement effect concerning the initial nanocrystalline Cu grain size.
Persistent Identifierhttp://hdl.handle.net/10722/360779
ISSN
2023 Impact Factor: 8.3
2023 SCImago Journal Rankings: 2.916

 

DC FieldValueLanguage
dc.contributor.authorWang, Y.-
dc.contributor.authorBian, Y. R.-
dc.contributor.authorHuang, M. X.-
dc.date.accessioned2025-09-13T00:36:20Z-
dc.date.available2025-09-13T00:36:20Z-
dc.date.issued2025-05-01-
dc.identifier.citationActa Materialia, 2025, v. 289-
dc.identifier.issn1359-6454-
dc.identifier.urihttp://hdl.handle.net/10722/360779-
dc.description.abstractIn this article, a general method for Kirkendall effect suppression has been proposed that harnesses the diffusivity enhancement effect brought by nanocrystalline metals. Through increasing the fraction of grain boundaries in the fast-diffusing species in the unbalanced diffusion couple, the flux of the slow diffusor can be enhanced through short-circuit diffusion, thus reducing the diffusivity gap, which is the root cause of the Kirkendall effect. Experiments have been performed on both Au-Cu and Au-Ag systems with successful results. A model has been established based on the Au-Cu system that predicts the diffusivity enhancement effect concerning the initial nanocrystalline Cu grain size.-
dc.languageeng-
dc.publisherElsevier-
dc.relation.ispartofActa Materialia-
dc.subject3D IC-
dc.subjectInterconnects-
dc.subjectKirkendall effect-
dc.subjectNanocrystalline metal-
dc.subjectThin film diffusion-
dc.titleKirkendall void inhibition through the elimination of diffusivity mismatch assisted by nanocrystalline metal-
dc.typeArticle-
dc.identifier.doi10.1016/j.actamat.2025.120938-
dc.identifier.scopuseid_2-s2.0-105000541332-
dc.identifier.volume289-
dc.identifier.eissn1873-2453-
dc.identifier.issnl1359-6454-

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