File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Lattice defect engineering advances n-type PbSe thermoelectrics

TitleLattice defect engineering advances n-type PbSe thermoelectrics
Authors
Issue Date14-Jan-2025
PublisherSpringer Nature
Citation
Nature Communications, 2025, v. 16, n. 1, p. 656 How to Cite?
AbstractTe-free thermoelectrics have garnered significant interest due to their immense thermoelectric potential and low cost. However, most Te-free thermoelectrics have relatively low performance because of the strong electrical and thermal transport conflicts and unsatisfactory compatibility of interfaces between device materials. Here, we develop lattice defect engineering through Cu doping to realize a record-high figure of merit of ~1.9 in n-type polycrystalline PbSe. Detailed micro/nanostructural characterizations and first-principles calculations demonstrate that Cu-induced interstitial defects and nanoprecipitates simultaneously optimize electron and phonon transport properties. Moreover, a robust Co/PbSe interface is designed to effectively prevent chemical reactions/diffusion; this interface exhibited a low electrical contact resistivity of ~10.9 μΩ cm2, excellent durability, and good stability in the thermoelectric module, which achieves a record-high conversion efficiency of 13.1% at a temperature difference of 460 K in segmented thermoelectric modules. This study lays the groundwork for advancing the development of Te-free selenide-based thermoelectric materials.
Persistent Identifierhttp://hdl.handle.net/10722/357546
ISSN
2023 Impact Factor: 14.7
2023 SCImago Journal Rankings: 4.887
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorDeng, Qian-
dc.contributor.authorShi, Xiao Lei-
dc.contributor.authorLi, Meng-
dc.contributor.authorTan, Xiaobo-
dc.contributor.authorLi, Ruiheng-
dc.contributor.authorWang, Chen-
dc.contributor.authorChen, Yue-
dc.contributor.authorDong, Hongliang-
dc.contributor.authorAng, Ran-
dc.contributor.authorChen, Zhi Gang-
dc.date.accessioned2025-07-22T03:13:25Z-
dc.date.available2025-07-22T03:13:25Z-
dc.date.issued2025-01-14-
dc.identifier.citationNature Communications, 2025, v. 16, n. 1, p. 656-
dc.identifier.issn2041-1723-
dc.identifier.urihttp://hdl.handle.net/10722/357546-
dc.description.abstractTe-free thermoelectrics have garnered significant interest due to their immense thermoelectric potential and low cost. However, most Te-free thermoelectrics have relatively low performance because of the strong electrical and thermal transport conflicts and unsatisfactory compatibility of interfaces between device materials. Here, we develop lattice defect engineering through Cu doping to realize a record-high figure of merit of ~1.9 in n-type polycrystalline PbSe. Detailed micro/nanostructural characterizations and first-principles calculations demonstrate that Cu-induced interstitial defects and nanoprecipitates simultaneously optimize electron and phonon transport properties. Moreover, a robust Co/PbSe interface is designed to effectively prevent chemical reactions/diffusion; this interface exhibited a low electrical contact resistivity of ~10.9 μΩ cm2, excellent durability, and good stability in the thermoelectric module, which achieves a record-high conversion efficiency of 13.1% at a temperature difference of 460 K in segmented thermoelectric modules. This study lays the groundwork for advancing the development of Te-free selenide-based thermoelectric materials.-
dc.languageeng-
dc.publisherSpringer Nature-
dc.relation.ispartofNature Communications-
dc.rightsThis work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.-
dc.titleLattice defect engineering advances n-type PbSe thermoelectrics-
dc.typeArticle-
dc.identifier.doi10.1038/s41467-025-56003-9-
dc.identifier.pmid39809777-
dc.identifier.scopuseid_2-s2.0-85215759099-
dc.identifier.volume16-
dc.identifier.issue1-
dc.identifier.spage656-
dc.identifier.eissn2041-1723-
dc.identifier.isiWOS:001397956900035-
dc.identifier.issnl2041-1723-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats