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Article: Recent progress of Ga2O3 power technology: large-area devices, packaging and applications

TitleRecent progress of Ga<inf>2</inf>O<inf>3</inf> power technology: large-area devices, packaging and applications
Authors
Keywordsgallium oxide
packaging
power converter
power electronics
power semiconductor devices
ruggedness
thermal management
Issue Date2023
Citation
Japanese Journal of Applied Physics, 2023, v. 62, article no. SF0801 How to Cite?
AbstractBenefitted from progress on the large-diameter Ga2O3 wafers and Ga2O3 processing techniques, the Ga2O3 power device technology has witnessed fast advances toward power electronics applications. Recently, reports on large-area (ampere-class) Ga2O3 power devices have emerged globally, and the scope of these works have gone well beyond the bare-die device demonstration into the device packaging, circuit testing, and ruggedness evaluation. These results have placed Ga2O3 in a unique position as the only ultra-wide bandgap semiconductor reaching these indispensable milestones for power device development. This paper presents a timely review on the state-of-the-art of the ampere-class Ga2O3 power devices (current up to >100 A and voltage up to >2000 V), including their static electrical performance, switching characteristics, packaging and thermal management, and the overcurrent/overvoltage ruggedness and reliability. Exciting research opportunities and critical technological gaps are also discussed.
Persistent Identifierhttp://hdl.handle.net/10722/352348
ISSN
2023 Impact Factor: 1.5
2023 SCImago Journal Rankings: 0.307

 

DC FieldValueLanguage
dc.contributor.authorQin, Yuan-
dc.contributor.authorWang, Zhengpeng-
dc.contributor.authorSasaki, Kohei-
dc.contributor.authorYe, Jiandong-
dc.contributor.authorZhang, Yuhao-
dc.date.accessioned2024-12-16T03:58:24Z-
dc.date.available2024-12-16T03:58:24Z-
dc.date.issued2023-
dc.identifier.citationJapanese Journal of Applied Physics, 2023, v. 62, article no. SF0801-
dc.identifier.issn0021-4922-
dc.identifier.urihttp://hdl.handle.net/10722/352348-
dc.description.abstractBenefitted from progress on the large-diameter Ga2O3 wafers and Ga2O3 processing techniques, the Ga2O3 power device technology has witnessed fast advances toward power electronics applications. Recently, reports on large-area (ampere-class) Ga2O3 power devices have emerged globally, and the scope of these works have gone well beyond the bare-die device demonstration into the device packaging, circuit testing, and ruggedness evaluation. These results have placed Ga2O3 in a unique position as the only ultra-wide bandgap semiconductor reaching these indispensable milestones for power device development. This paper presents a timely review on the state-of-the-art of the ampere-class Ga2O3 power devices (current up to >100 A and voltage up to >2000 V), including their static electrical performance, switching characteristics, packaging and thermal management, and the overcurrent/overvoltage ruggedness and reliability. Exciting research opportunities and critical technological gaps are also discussed.-
dc.languageeng-
dc.relation.ispartofJapanese Journal of Applied Physics-
dc.subjectgallium oxide-
dc.subjectpackaging-
dc.subjectpower converter-
dc.subjectpower electronics-
dc.subjectpower semiconductor devices-
dc.subjectruggedness-
dc.subjectthermal management-
dc.titleRecent progress of Ga<inf>2</inf>O<inf>3</inf> power technology: large-area devices, packaging and applications-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.35848/1347-4065/acb3d3-
dc.identifier.scopuseid_2-s2.0-85148237663-
dc.identifier.volume62-
dc.identifier.spagearticle no. SF0801-
dc.identifier.epagearticle no. SF0801-
dc.identifier.eissn1347-4065-

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