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Article: Recent progress of Ga2 O3 power technology: large-area devices, packaging and applications
Title | Recent progress of Ga<inf>2</inf>O<inf>3</inf> power technology: large-area devices, packaging and applications |
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Authors | |
Keywords | gallium oxide packaging power converter power electronics power semiconductor devices ruggedness thermal management |
Issue Date | 2023 |
Citation | Japanese Journal of Applied Physics, 2023, v. 62, article no. SF0801 How to Cite? |
Abstract | Benefitted from progress on the large-diameter Ga2O3 wafers and Ga2O3 processing techniques, the Ga2O3 power device technology has witnessed fast advances toward power electronics applications. Recently, reports on large-area (ampere-class) Ga2O3 power devices have emerged globally, and the scope of these works have gone well beyond the bare-die device demonstration into the device packaging, circuit testing, and ruggedness evaluation. These results have placed Ga2O3 in a unique position as the only ultra-wide bandgap semiconductor reaching these indispensable milestones for power device development. This paper presents a timely review on the state-of-the-art of the ampere-class Ga2O3 power devices (current up to >100 A and voltage up to >2000 V), including their static electrical performance, switching characteristics, packaging and thermal management, and the overcurrent/overvoltage ruggedness and reliability. Exciting research opportunities and critical technological gaps are also discussed. |
Persistent Identifier | http://hdl.handle.net/10722/352348 |
ISSN | 2023 Impact Factor: 1.5 2023 SCImago Journal Rankings: 0.307 |
DC Field | Value | Language |
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dc.contributor.author | Qin, Yuan | - |
dc.contributor.author | Wang, Zhengpeng | - |
dc.contributor.author | Sasaki, Kohei | - |
dc.contributor.author | Ye, Jiandong | - |
dc.contributor.author | Zhang, Yuhao | - |
dc.date.accessioned | 2024-12-16T03:58:24Z | - |
dc.date.available | 2024-12-16T03:58:24Z | - |
dc.date.issued | 2023 | - |
dc.identifier.citation | Japanese Journal of Applied Physics, 2023, v. 62, article no. SF0801 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | http://hdl.handle.net/10722/352348 | - |
dc.description.abstract | Benefitted from progress on the large-diameter Ga2O3 wafers and Ga2O3 processing techniques, the Ga2O3 power device technology has witnessed fast advances toward power electronics applications. Recently, reports on large-area (ampere-class) Ga2O3 power devices have emerged globally, and the scope of these works have gone well beyond the bare-die device demonstration into the device packaging, circuit testing, and ruggedness evaluation. These results have placed Ga2O3 in a unique position as the only ultra-wide bandgap semiconductor reaching these indispensable milestones for power device development. This paper presents a timely review on the state-of-the-art of the ampere-class Ga2O3 power devices (current up to >100 A and voltage up to >2000 V), including their static electrical performance, switching characteristics, packaging and thermal management, and the overcurrent/overvoltage ruggedness and reliability. Exciting research opportunities and critical technological gaps are also discussed. | - |
dc.language | eng | - |
dc.relation.ispartof | Japanese Journal of Applied Physics | - |
dc.subject | gallium oxide | - |
dc.subject | packaging | - |
dc.subject | power converter | - |
dc.subject | power electronics | - |
dc.subject | power semiconductor devices | - |
dc.subject | ruggedness | - |
dc.subject | thermal management | - |
dc.title | Recent progress of Ga<inf>2</inf>O<inf>3</inf> power technology: large-area devices, packaging and applications | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.35848/1347-4065/acb3d3 | - |
dc.identifier.scopus | eid_2-s2.0-85148237663 | - |
dc.identifier.volume | 62 | - |
dc.identifier.spage | article no. SF0801 | - |
dc.identifier.epage | article no. SF0801 | - |
dc.identifier.eissn | 1347-4065 | - |