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Article: Building 3D integrated circuits with electronics and photonics

TitleBuilding 3D integrated circuits with electronics and photonics
Authors
Xiang, ChaoBowers, John E
Issue Date1-Jun-2024
PublisherNature Research
Citation
Nature Electronics, 2024, v. 7, n. 6, p. 422-424 How to Cite?
DOI: http://dx.doi.org/10.1038/s41928-024-01187-z
AbstractThe three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.
Persistent Identifierhttp://hdl.handle.net/10722/348444
ISSN
2520-1131
2023 Impact Factor: 33.7
2023 SCImago Journal Rankings: 11.667

 

DC FieldValueLanguage
dc.contributor.authorXiang, Chao-
dc.contributor.authorBowers, John E-
dc.date.accessioned2024-10-09T00:31:32Z-
dc.date.available2024-10-09T00:31:32Z-
dc.date.issued2024-06-01-
dc.identifier.citationNature Electronics, 2024, v. 7, n. 6, p. 422-424-
dc.identifier.issn2520-1131-
dc.identifier.urihttp://hdl.handle.net/10722/348444-
dc.description.abstractThe three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.-
dc.languageeng-
dc.publisherNature Research-
dc.relation.ispartofNature Electronics-
dc.rightsThis work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.-
dc.titleBuilding 3D integrated circuits with electronics and photonics-
dc.typeArticle-
dc.identifier.doi10.1038/s41928-024-01187-z-
dc.identifier.scopuseid_2-s2.0-85197609438-
dc.identifier.volume7-
dc.identifier.issue6-
dc.identifier.spage422-
dc.identifier.epage424-
dc.identifier.eissn2520-1131-
dc.identifier.issnl2520-1131-

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